Die-to-Die (D2D) Applications Engineer

Job Title

Die-to-Die (D2D) Applications Engineer

Role Summary

Primary technical resource for internal and external customers integrating and deploying Broadcom's proprietary Die-to-Die (D2D) PHY IP. The role spans RTL integration and simulation, firmware and embedded software interaction, silicon bring-up, production test support, and cross-functional escalation.

Experience Level

Mid-level. The posting requests candidates with experience equivalent to 5+ years with a Bachelor's degree or 3+ years with a Master’s degree; generally aligns with 3–7 years of relevant experience.

Responsibilities

Provide hands-on technical support across the full IP lifecycle and work directly with customers and internal teams to triage and resolve integration issues.

• Support customers integrating the D2D PHY IP into ASIC designs and products.
• Run and debug Verilog/RTL simulations during customer integrations.
• Assist with silicon bring-up, characterization, and lab debug.
• Support DFT and ATE production test development with PHY-specific guidance.
• Triage cross-domain issues that span RTL, firmware/embedded software, and system-level hardware to identify root cause.
• Develop and maintain internal documentation, debug guides, and application notes based on recurring issues.
• Work cross-functionally with design, verification, firmware, product engineering, and test teams to close issues.
• Participate in customer-facing technical discussions, simulation reviews, and post-silicon debug sessions.

Requirements

Required technical skills and experience (education items are summarized under Education Requirements below).

• Hands-on experience running and debugging Verilog/RTL simulations.
• Strong debugging skills in at least two domains: RTL/digital logic, firmware, embedded software, or system-level hardware.
• Ability to trace issues across hardware and software boundaries and identify root cause.
• Solid understanding of digital design fundamentals and common chip-level interfaces/protocols.
• Scripting for debug automation and log analysis (Python, Ruby, Tcl).
• Familiarity with embedded firmware development or debug (C/C++, register-level debug, on-chip debug tools).
• Strong verbal and written communication skills for technical customer interactions.
• Self-directed, comfortable owning ambiguous, open-ended debug problems.

Preferred:

• Direct experience with Die-to-Die (D2D) PHY IP, chiplet interconnects, or high-speed SerDes/PHY IP.
• Experience with silicon bring-up, lab debug equipment (oscilloscopes, logic analyzers, protocol analyzers), and characterization.
• Experience supporting DFT and/or ATE test development (scan, BIST, test pattern debug).
• Prior applications engineering, field applications engineering (FAE), or customer-facing technical support experience.

Education Requirements

Bachelor's degree in Electrical Engineering or Computer Engineering (or equivalent) with 5+ years related experience, or Master's degree with 3+ years related experience. Equivalent practical experience in relevant technical domains is acceptable.

About the Company

Company: Broadcom

Headquarters: Irvine, California, United States

Broadcom is a global technology leader that designs, develops, and supplies a wide range of semiconductor and infrastructure software solutions. The company is known for its innovations in wireless and broadband communications, enabling a connected world.