Die Sort Module Engineer

Job Title

Die Sort Module Engineer

Role Summary

Support high-volume die sort equipment and processes at Intel's New Mexico Advanced Packaging manufacturing site. Ensure equipment performance, yield, safety, and manufacturability through monitoring, troubleshooting, process optimization and cross-functional collaboration.

The role supports new product introductions (NPIs), production ramps, and continuous improvement activities with technicians, technology development teams, vendors, and Virtual Factory partners.

Experience Level

Mid-level. The posting requires experience in semiconductor device fabrication or semiconductor manufacturing (see Education Requirements for degree-plus-years guidance).

Responsibilities

Accountable for equipment performance, process control, and cross-functional delivery in die sort operations.

• Own and optimize sort equipment performance: troubleshooting, preventive maintenance, repair improvements, and excursion response.
• Develop, implement, and optimize recipes for NPIs and production processes.
• Monitor processes, analyze data, and apply statistical process control to drive yield and quality improvements.
• Perform root-cause analysis and implement corrective actions for integrated processing issues.
• Partner with Technology Development and Virtual Factory teams to transfer and optimize processes and technologies.
• Oversee installation, qualification, and maintenance of new and existing equipment during factory ramps.
• Train, mentor, and coach technicians; provide manufacturing support with a customer-oriented approach.
• Collaborate with internal teams and external equipment vendors to implement process and operational improvements.
• Plan and execute medium-term projects (two+ months) to deliver process and hardware improvements.

Requirements

Must-have skills and experience.

• Hands-on experience with semiconductor process and equipment troubleshooting, maintenance, or development in a manufacturing environment.
• Proficiency with statistical process control, data analysis, and engineering analysis tools.
• Experience with structured problem-solving and root-cause analysis methodologies (e.g., MBPS, DOE, FMEA).
• Experience developing and qualifying process changes, recipes, or equipment adjustments for production.
• Ability to manage multiple priorities across process engineering, sustaining, continuous improvement, and transfer activities.
• Strong verbal and written communication skills; ability to influence and collaborate across functions.
• Demonstrated ability to plan and execute projects lasting two or more months.
• Must be able to work regularly onsite in New Mexico.

Nice-to-have.

• Previous sort/test experience and experience in high-volume manufacturing or technology development environments.
• Data fluency: data extraction, visualization, and interpretation for decision-making.
• Experience leading or facilitating cross-functional task forces and working with external suppliers/vendors.

Education Requirements

Candidates must have one of the following: a Bachelor's degree in Electrical, Mechanical, or Chemical Engineering, Materials Science, or a related technical discipline plus 3+ years of semiconductor device fabrication or manufacturing experience; OR a Master's degree or PhD in those fields plus 2+ years of semiconductor device fabrication or manufacturing experience.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.