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Device Modeling Engineer

Texas Instruments
February 27, 2026
Full-time
On-site
Bengaluru, Karnataka, India
Level - Senior

Job Title

Device Modeling Engineer

Role Summary

Join TI's SPICE Modeling Group to drive innovation in semiconductor technology. In this role, you will extract and optimize compact models for next-generation devices while collaborating with engineers across various disciplines.

Experience Level

Senior; requires a minimum of 5 years of experience in compact (SPICE) modeling and semiconductor technology.

Responsibilities

Key responsibilities include:

  • Extract compact models for advanced semiconductor devices (e.g., MOS, LDMOS, GaN).
  • Collaborate with designers to deploy modeling solutions.
  • Develop innovative model formulations for emerging device technologies.
  • Automate modeling infrastructure to enhance technology development.
  • Create AI/ML-enhanced models and parameter extraction methodologies.
  • Validate models through detailed measurement and analysis.

Requirements

Minimum requirements include:

  • Ph.D. in Electrical Engineering or a related field.
  • 5+ years of experience in SPICE modeling and semiconductor technology.

Preferred qualifications are:

  • Expertise in models (BSIM, MEXTRAM) and parameter extraction tools (ICCAP).
  • Proficient in EDA tools (Cadence) and SPICE simulators (Spectre).
  • Strong programming skills in MATLAB/Python.
  • Statistical analysis experience with large datasets.
  • Knowledge in AI/ML and TCAD.

Education Requirements

Doctorate Degree in Electrical Engineering or related field.


About the Company

Company: Texas Instruments

Headquarters: Dallas, Texas, USA

Texas Instruments is a global semiconductor company that designs, manufactures, and sells analog and embedded processing chips for various markets including industrial, automotive, and personal electronics. The company's innovations aim to make electronics more affordable and reliable, fostering advancements in technology through each generation of semiconductors.

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Date Posted: 2026-02-27