Device Engineering Intern, Silicon Photonics (Summer 2027)

Job Title

Device Engineering Intern, Silicon Photonics (Summer 2027)

Role Summary

Support the Silicon Photonics modeling team to develop compact models for optical and electro-optical devices. The intern will perform device characterization, extract model parameters, implement compact models in Verilog-A, and automate modeling workflows.

Experience Level

Entry-level internship for undergraduate (sophomore or above) or graduate students. Full-time summer placement; students should be available to work approximately 40 hours per week.

Responsibilities

Primary tasks include hands-on device characterization, model development, coding, and automation for the silicon photonics team.

• Design and lay out silicon photonics device characterization structures.
• Perform device characterization and analyze measurement data.
• Develop scripts to extract model parameters from characterization results.
• Implement compact device models using Verilog-A.
• Create automation flows and scripts for repetitive characterization, modeling, and data analysis tasks.
• Follow Environmental, Health, Safety & Security (EHS) requirements and work safely in lab environments.

Requirements

Must-have qualifications and expectations for successful candidates; preferred skills listed separately.

• English fluency (written and verbal).
• Availability to work full-time during the internship (approximately 40 hours per week).
• Ability to perform lab work and follow EHS procedures.

Nice-to-have / preferred:

• Prior internship or co-op experience in semiconductors or photonics.
• Leadership experience on projects or teams.
• Interest in using AI tools and automation to improve workflows.
• Project management, planning, and organizational skills.
• Strong applied mathematics skills.
• Programming experience in MATLAB, Python, R, or similar languages.
• Strong written and verbal communication skills.

Education Requirements

At minimum a sophomore-level undergraduate student at time of application, or actively enrolled in a Master's or PhD program in Physics, Electrical Engineering, Electronic Engineering, or a related technical field. Minimum overall GPA of 3.0 and in good academic standing during the internship period.

About the Company

Company: GlobalFoundries

Headquarters: Saratoga Springs, New York, USA

GlobalFoundries is a leading contract manufacturer for the global semiconductor industry, with facilities in multiple countries, including the USA. The company develops a broad portfolio of semiconductor technologies and employs around 13,000 people worldwide. GlobalFoundries focuses on enhancing competitiveness in specialized application solutions and fostering innovation in mobile communications, consumer electronics, and automotive applications.