Device Compact Modeling Engineer

Job Title

Device Compact Modeling Engineer

Role Summary

Lead device compact modeling for CMOS BCD technology within the Power Product Line. Responsible for extracting and validating transistor and passive compact models, correlating models to hardware, defining test structures, analyzing measurement data, and supporting internal teams and customers.

Work with device, modeling, and fabrication teams to deliver model releases, integrate models into PDK kits, and provide customer support.

Experience Level

Senior — typically requires 10+ years of related industry experience.

Responsibilities

Key responsibilities include technical leadership, model extraction, validation, and customer support.

• Lead teams to extract and validate compact models for transistors and passive devices in CMOS BCD technologies.
• Correlate compact models to hardware through data analysis, benchmarking, and targeted measurement campaigns.
• Design test structures and device matrices for modeling test chips and coordinate layout planning.
• Perform DC/AC/HV characterization, model extraction and fitting using BSIM4.x, BSIM6 and PSP model architectures; produce SPECTRE and HSPICE model formats.
• Create and maintain test cases and run simulations for PDK integration and model QA/debugging.
• Prepare technical reports, model release notes, reference documents and application notes documenting limitations and solutions.
• Interface with fabrication and device teams and communicate with customers to support adoption and troubleshooting.
• Support Environmental, Health, Safety & Security requirements in all activities.

Requirements

Must-have technical skills and practical experience; preferred items listed separately.

• Proven expertise in compact model extraction for core, IO and HV devices in BCD technologies.
• Strong understanding of device physics for bulk CMOS/BCD and its impact on device performance.
• Practical experience with DC/AC/HV characterization and model extraction workflows.
• Experience producing models in SPECTRE and HSPICE formats and integrating models into PDK kits.
• Familiarity with IP development considerations for device models.
• Ability to lead multidisciplinary teams and coordinate cross-functional work across sites.
• Customer-facing communication skills and experience supporting customers' model usage.
• Willingness to travel up to 10% and fluency in English.

Preferred:

• Familiarity with RF device modeling.
• Experience mentoring junior engineers and leading high-impact projects.
• Strong planning and organizational skills.

Education Requirements

Master's or PhD in electrical engineering or a related technical field required, combined with approximately 10 years of relevant industry experience. No alternate-equivalent-experience language is specified in the posting.

About the Company

Company: GlobalFoundries

Headquarters: Saratoga Springs, New York, USA

GlobalFoundries is a leading contract manufacturer for the global semiconductor industry, with facilities in multiple countries, including the USA. The company develops a broad portfolio of semiconductor technologies and employs around 13,000 people worldwide. GlobalFoundries focuses on enhancing competitiveness in specialized application solutions and fostering innovation in mobile communications, consumer electronics, and automotive applications.