Design Lead (HBM/Advanced Memory Design)
Micron TechnologyJob Title
Design Lead (HBM/Advanced Memory Design)
Role Summary
Lead architecture, design, integration, and execution of next-generation HBM and advanced memory products. Drive cross-functional collaboration with verification, layout, CAD, product engineering, and technology teams to deliver high-quality silicon on aggressive schedules.
Experience Level
Senior - 15+ years of semiconductor design experience, with demonstrated leadership of complex IC development programs.
Responsibilities
Technical and program leadership for advanced memory design projects. Key duties include:
- Lead design and execution of complex memory subsystems and top-level integration.
- Own design planning, technical decisions, risk assessment, and schedule delivery.
- Coordinate architecture, verification, layout, DFT, product engineering, and technology teams to ensure manufacturability and quality.
- Review specifications, microarchitecture documents, and implementation plans.
- Drive RTL, mixed-signal, memory controller, PHY, or custom circuit design activities as required.
- Lead design reviews and drive cross-organizational issue resolution.
- Mentor and develop early-career engineers and provide technical leadership to project teams.
- Define and improve methodologies using automation and AI-enabled tools.
- Support silicon bring-up, debug, characterization, and yield-improvement activities.
- Communicate project status, risks, and mitigation plans to management and stakeholders.
Requirements
Must-have technical and leadership qualifications:
- 15+ years of semiconductor design experience with leadership responsibility for complex IC programs.
- Proven ability to lead multi-functional teams and deliver on schedule.
- Strong understanding of digital and/or custom circuit design methodologies.
- Experience with RTL design (Verilog/SystemVerilog), timing closure, and physical implementation concepts.
- Experience with verification, debug flows, DFT, and silicon validation.
- Expertise in power, performance, and area (PPA) optimization.
Nice-to-have:
- Experience with DRAM families (DDR, HBM, LPDDR) or other advanced memory products.
- Familiarity with advanced process nodes, advanced packaging (2.5D/3D, TSV), and package integration.
- Experience with Synopsys and Cadence implementation flows and global team leadership.
Education Requirements
BS, MS, or PhD in Electrical Engineering, Computer Engineering, or a related technical field.
About the Company
Company: Micron Technology
Headquarters: Boise, Idaho, USA
Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.
