Design Lead (HBM/Advanced Memory Design)

Job Title

Design Lead (HBM/Advanced Memory Design)

Role Summary

Lead architecture, design, integration, and execution of next-generation HBM and advanced memory products. Drive cross-functional collaboration among Design, Verification, Layout, CAD, Product Engineering, and Technology Development to deliver silicon on aggressive schedules.

Experience Level

Senior; typically requires 10+ years of semiconductor design experience and demonstrated leadership of complex IC development programs.

Responsibilities

Primary responsibilities include technical leadership, design planning, integration, and support for silicon bring-up.

• Lead design and execution of memory subsystems and top-level integration activities.
• Own design planning, technical decision-making, risk assessment, and schedule execution.
• Coordinate with architecture, verification, layout, DFT, and product engineering to ensure manufacturability and design quality.
• Drive memory array design, address decoders, datapath, internal power supplies, and custom circuit design as required.
• Lead design reviews and drive cross-organizational issue resolution.
• Mentor and guide engineers; provide technical leadership to project teams.
• Define and improve methodologies using AI-enabled tools and automation.
• Support silicon bring-up, debug, characterization, and yield improvement activities.
• Communicate project status, risks, and mitigation plans to management and collaborators.

Requirements

Must-have technical skills and experience.

• 10+ years of semiconductor design experience.
• Proven experience leading complex IC development programs and multi-functional teams.
• Strong understanding of digital and/or custom circuit design methodologies.
• Experience with memory array design, address decoders, and datapath architecture.
• Experience with power delivery, repair schemes, and power/performance/area/thermal optimization.
• Experience with verification and debug flows, DFT, and silicon validation.
• Track record of successful product tape-outs and delivering on schedule.

Nice-to-have:

• Experience with DRAM, DDR, HBM, LPDDR, or other advanced memory products.
• Experience leading global, multi-functional teams.
• Familiarity with advanced process nodes and design-for-manufacturing concepts.
• Experience with Synopsys and Cadence implementation flows.
• Familiarity with package integration, 2.5D/3D stacking, TSV, and advanced packaging technologies.

Education Requirements

BS, MS, or PhD in Electrical Engineering, Computer Engineering, or a related technical field.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.