CUF TD Module Engineer

Job Title

CUF TD Module Engineer

Role Summary

Responsible for developing and optimizing capillary underfill (CUF) module assembly processes and equipment to meet quality, reliability, cost, yield and manufacturability targets. Works with packaging technology, manufacturing, supplier quality and procurement teams to validate materials, develop reliability tests, and transfer processes to production.

This role requires regular on-site presence in Kulim to perform hands-on process and equipment development and to collaborate with vendors and cross-functional teams.

Experience Level

Mid-level; typically requires at least 3 years of relevant experience in semiconductor packaging, assembly process engineering, or related fields.

Responsibilities

Key responsibilities include:

• Develop and optimize CUF module assembly processes and related equipment.
• Design and execute experiments (DOE), analyze data, and document process improvements.
• Maintain and develop equipment to evaluate silicon and package technologies under simulated field conditions (thermal, humidity, mechanical).
• Define and enforce material and equipment specifications for contract assemblers and raw material vendors.
• Establish quality screens, acceleration methods and reliability requirements to detect and mitigate packaging issues early.
• Ensure manufacturability of package layouts and oversee manufacturing process flows and procedures.
• Provide technical consultation on packaging problems and respond to customer or manufacturing events.
• Collaborate with packaging technology development and partner engineering groups on process maturity and risk mitigation.

Requirements

Must-have technical skills and experience:

• Fundamental understanding of semiconductor assembly equipment and processes.
• Experience applying design-of-experiments and statistical methods to process development.
• Hands-on experience developing or optimizing manufacturing processes and related hardware/toolsets.
• Knowledge of reliability testing and failure mechanisms relevant to packaging.
• Experience specifying materials/equipment and working with suppliers to meet quality and performance requirements.
• Strong problem-solving skills and demonstrated continuous improvement delivery.
• Ability to work on-site in Kulim and collaborate with cross-functional teams and external vendors.

Education Requirements

Preferred MSc or PhD in Mechanical Engineering, Materials Engineering, Electrical Engineering, Chemical Engineering, Physics or related fields with focus on thermal/fluid/packaging assembly process engineering. A Bachelor's degree with strong relevant experience is acceptable. Equivalent practical experience is considered; the posting references a typical minimum of ~3 years' relevant work experience.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.