Cross-Domain Manufacturing Systems Engineering Intern (Strategic Student Program, Spring 2027)
SiemensJob Title
Cross-Domain Manufacturing Systems Engineering Intern (Strategic Student Program, Spring 2027)
Role Summary
Internship within the Cross Product Solution Management (CPSM) team focused on integrating semiconductor EDA/CAE, PLM, mechanical, and system-level engineering into end-to-end workflows. The role contributes to research, software prototyping, automation, and documentation that support a "silicon-to-rack" engineering initiative.
Experience Level
Entry-level internship for university students (senior undergraduates, master's, or Ph.D. candidates). Intended for students graduating 2028 or later.
Responsibilities
Work with senior engineers to research, prototype, and document integrated engineering workflows.
- Research and evaluate emerging semiconductor engineering technologies and workflows (including 3D IC and advanced packaging).
- Develop software prototypes, automation tools, and proof-of-concept solutions.
- Support semiconductor, PCB, and system-level design, validation, and implementation concepts.
- Document technical findings through white papers, tutorials, and technical guides.
- Investigate AI-assisted engineering and documentation workflows and learn industry EDA and PLM tools.
- Help define and demonstrate an end-to-end digital thread from silicon design through system deployment.
Requirements
Key skills and attributes for successful performance. Degree and field expectations are listed under Education Requirements below.
- Must-have: Strong analytical and problem-solving skills; excellent verbal and written communication; ability to learn quickly and work independently; self-motivated and adaptable.
- Must-have: Authorized to work in the United States without need for current or future sponsorship.
- Nice-to-have: Exposure to semiconductor packaging design, CAE, EDA, PLM, automation, or AI technologies.
- Nice-to-have: Familiarity with Linux or scripting environments and prior internship, co-op, or project experience.
Education Requirements
Currently enrolled as a university senior, master’s, or Ph.D. candidate in Mechanical Engineering, Electrical/Electronics Engineering, Computer Engineering, Computer Science, or a related STEM field. Minimum 3.0 GPA. Expected graduation 2028 or later. Must be authorized to work in the United States without sponsorship.
About the Company
Company: Siemens
Headquarters: Munich, Germany
Siemens EDA is a leading global provider of Electronic Design Automation (EDA) products and systems. Their innovative solutions enable companies to enhance the development of electronic products efficiently and effectively, keeping pace with the complex demands of technology and physics. Siemens is committed to delivering advanced workflow solutions that integrate both EDA and MCAD tools for multi-domain design and manufacturing in the semiconductor industry.
