CPU Core Physical Design Technical Graduate Intern (Spring 2027)
Intel CorporationJob Title
CPU Core Physical Design Technical Graduate Intern (Spring 2027)
Role Summary
Join Intel's Data Center Group (DCG) as a Physical Design graduate intern to assist with the physical implementation of CPU core silicon. The role involves hands-on tasks in synthesis, place & route, timing analysis, clocking, integration, and support for verification and signoff to produce manufacturing-ready designs.
Internship period: January 2027 – August 2027. Role is eligible for Intel's hybrid work model; relocation is available. Ideal candidates are local to the Folsom area or can arrange a semester-away placement.
Experience Level
Entry-level (Graduate intern / student). This is a university internship role intended for current graduate students.
Responsibilities
Primary responsibilities focus on practical physical design tasks and cross-functional collaboration.
- Support physical design implementation: synthesis, place and route, and integration.
- Perform timing analysis and clocking to optimize design performance.
- Assist verification and signoff activities to ensure manufacturability and compliance.
- Work with cross-functional teams to improve design scalability and automation.
- Execute hands-on project tasks and learn industry-standard physical design flows and tools.
Requirements
Must-have technical skills and experience for immediate contribution.
- Fundamental knowledge of logic synthesis, place & route, and static timing analysis (STA).
- Familiarity with semiconductor design flows and ASIC/SoC implementation concepts.
- Programming or scripting experience in one or more languages such as Perl, Tcl, or Python.
- Practical problem-solving skills and ability to work in a team on engineering projects.
Nice-to-have (preferred) skills:
- Hands-on experience with synthesis, place & route, and timing analysis.
- Knowledge of low-power design techniques and PPA (performance, power, area) optimization.
- Experience with EDA tools used in ASIC/SoC physical design.
- Project, research, or coursework experience in VLSI or semiconductor design.
Education Requirements
Must be a current graduate student pursuing a Master's degree in Electrical Engineering (EE), Computer Engineering (CE), or a related technical field. Relevant coursework, academic projects, or research in digital integrated circuit design and VLSI physical design are expected.
About the Company
Company: Intel Corporation
Headquarters: Santa Clara, California, USA
Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.
