Job Title
Component Engineer - Semiconductor
Role Summary
Responsible for semiconductor component engineering for the CommIC product family within the CETQ organization. The role owns design-in, testing, manufacturing, quality, qualification, and lifecycle activities for CommIC components and acts as the primary technical resource for design and manufacturing teams.
This is a hybrid position with an expectation of approximately two days per week onsite at an HPE office.
Experience Level
Senior β generally requires multiple years of semiconductor development and component/manufacturing experience (see Education Requirements for degree guidance).
Responsibilities
Key responsibilities include:
- Define and review CommIC product test coverage for new product introduction (NPI) and sustaining phases.
- Drive testing optimization across stakeholders to improve quality, cost, efficiency, and reduce risk.
- Investigate and resolve component quality issues originating from customers or manufacturing; coordinate corrective actions with suppliers.
- Lead failure analysis, containment, and corrective action efforts; escalate and interface with manufacturing and engineering management to resolve complex problems.
- Evaluate and monitor supplier performance, including technology, yield, DPPM, service, and reliability improvements.
- Contribute to commodity strategy, supplier selection, and perform supplier technical audits.
- Partner with Supplier Quality Engineering on component quality metrics and initiatives to ensure defect-free shipments.
- Assess and qualify new CommIC components and lead value-engineering activities.
- Manage maintenance and change control for the Approved Vendor List (AVL) and associated documentation using applicable tools.
Requirements
Must-have skills and experience:
- Extensive knowledge of semiconductor device physics, fabrication processes, design, architecture, manufacturing, test, assembly, failure modes, quality, and reliability.
- Practical experience with component qualification, testing, and manufacturing support for die-level and packaged parts.
- Experience working with Linux or FreeBSD platforms for testing or tooling environments.
- Proven ability to lead cross-functional teams, communicate complex technical issues to varied audiences, and coordinate escalations.
- Experience driving supplier corrective actions, supplier audits, and managing supplier performance metrics.
- Strong analytical, data-driven problem-solving skills and attention to product quality and reliability.
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Nice-to-have: Experience in high-speed networking or large complex systems manufacturing environments; experience with AVL/document management software.
Education Requirements
Typically requires a Master of Science in Electrical Engineering (MSEE) or equivalent; equivalent practical experience is acceptable. The posting references semiconductor development and component/manufacturing experience as part of the qualification.
About the Company
Company: Hewlett Packard Enterprise
Headquarters: Spring, TX, United States
Global enterprise technology company delivering hybrid cloud, edge-to-cloud platforms, servers, storage, networking, and IT services to help organizations build, run, and secure applications and infrastructure at scale.

Date Posted: 2026-05-19