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CMOS BEOL Reliability Engineering Intern (Summer 2027)

GlobalFoundries
September 29, 2026
Internship
On-site
Malta, New York, United States
Process Engineering Jobs, Level - Entry or Early Career

Job Title

CMOS BEOL Reliability Engineering Intern (Summer 2027)

Role Summary

Work as an intern in the Fab 8 Reliability Engineering organization to develop and implement inline methods for assessing risks from critical back-end-of-line (BEOL) defects in automotive products. The role combines defect data analysis, reliability physics, and cross-functional collaboration to produce actionable monitoring metrics and recommendations.

Experience Level

Entry-level internship (student role).

Responsibilities

Contribute to a defined project under mentorship; deliver analyses, tools, and a final technical presentation.

  • Learn BEOL reliability fundamentals, failure mechanisms, inline defect monitoring, and FMEA.
  • Analyze inline defect datasets and SEM images to identify manufacturing defects affecting reliability.
  • Map observed defect types to degradation mechanisms (e.g., electromigration, TDDB) to assess criticality.
  • Perform statistical analysis to translate normalized defect densities into product-relevant defective-parts-per-million risk estimates.
  • Develop data-analysis and visualization tools or dashboards to communicate defect trends, risk calculations, assumptions, and sensitivities.
  • Support development of consistent monitoring methodologies for reliability-critical defects in representative automotive products.
  • Document methods and results, collaborate with Reliability Engineering, Contamination-Free Manufacturing, and Process Integration teams, and present findings.
  • Deliver a final technical presentation summarizing methods, results, limitations, and recommendations.
  • Follow Environmental, Health, Safety & Security requirements in all work activities.

Requirements

Essential qualifications and work expectations for the internship.

  • Ability to work at least 40 hours per week during the internship period.
  • English fluency (written and verbal).
  • Strong analytical, quantitative, and problem-solving skills.
  • Ability to work independently and collaborate in a cross-functional engineering environment.
  • Ability to document technical methods and communicate project status via reports and presentations.

Education Requirements

At least a sophomore at time of application and actively pursuing a Bachelor's, Master's, or PhD in Electrical Engineering, Materials Science, Physics, Chemical Engineering, Mechanical Engineering, Computer Engineering, Data Science, Semiconductor Engineering, or a related field through an accredited degree program during the internship. Must have at least a 3.0 overall GPA and be in good academic standing.

Preferred Qualifications

Nice-to-have skills and experiences that will accelerate contribution.

  • Prior related internship or co-op experience and leadership experience in projects or competitions.
  • Coursework or experience in semiconductor devices, materials, manufacturing, reliability, statistics, or data analytics.
  • Familiarity with BEOL interconnects, copper metallization, dielectric materials, electromigration, or TDDB.
  • Experience with Python, JMP, Minitab, Excel, Power BI, MATLAB, or similar analysis and visualization tools.
  • Experience organizing technical data, automating calculations, developing dashboards, and presenting engineering results.
  • Interest in leveraging AI tools to improve productivity and decision-making; project management and communication skills.

About the Company

Company: GlobalFoundries

Headquarters: Saratoga Springs, New York, USA

GlobalFoundries is a leading contract manufacturer for the global semiconductor industry, with facilities in multiple countries, including the USA. The company develops a broad portfolio of semiconductor technologies and employs around 13,000 people worldwide. GlobalFoundries focuses on enhancing competitiveness in specialized application solutions and fostering innovation in mobile communications, consumer electronics, and automotive applications.

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Date Posted: 2026-09-28