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Chip Integration Engineer

Broadcom
Full-time
On-site
San Jose, California, United States
$120,000 - $192,000 USD yearly
Level - Mid-Career

Role Summary

The Network Switch Group at Broadcom develops cutting-edge networking ASICs and multichip solutions for L2/L3 switch routing. This role focuses on chip integration and RTL design for network switch/routing designs.

Experience Level

Mid-level, requiring approximately 6 years with MSEE or 8 years with BSEE.

Responsibilities

The Chip Integration Engineer will be responsible for:

  • Defining microarchitecture and implementing chip top-level modules for ASICs.
  • Chip-level integration of functional blocks, soft/hard IPs, I/Os, and memories.
  • Collaboration with design teams on microarchitecture and interface definition.
  • Planning physical implementation and initial floor planning of chip-level blocks.
  • Developing Verilog RTL, providing design verification support, and conducting timing analysis.
  • Working closely with the physical implementation team throughout the design process.

Requirements

Applicants must have:

  • MSEE +6 years of experience or BSEE +8 years with a focus on digital design.
  • In-depth knowledge of IC technology, ASIC design flows, and EDA tools.
  • Thorough understanding of high-speed Ethernet networking and CPU I/O bus technologies.
  • Excellent knowledge of SystemVerilog and experience with simulators and waveform debugging tools.
  • Strong skills in Perl, Python, or other scripting languages.
  • Excellent verbal and written communication skills.

Education Requirements

Master's degree in Electrical Engineering or related field, or Bachelor's degree with additional experience.


About the Company

Company: Broadcom

Headquarters: Irvine, California, United States

Broadcom is a global technology leader that designs, develops, and supplies a wide range of semiconductor and infrastructure software solutions. The company is known for its innovations in wireless and broadband communications, enabling a connected world.

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Date Posted: 2026-03-05