Chip Integration Design Lead
BroadcomJob Title
Chip Integration Design Lead
Role Summary
Lead chip integration for complex ASIC/SoC projects, coordinating across block design, verification, IP, physical design, microarchitecture, software, and board teams to deliver tapeout-ready silicon.
Experience Level
Senior — lead-level role. Years of experience not specified in the posting.
Responsibilities
Primary responsibilities include:
- Drive chip integration from RTL through synthesis, place-and-route, timing closure, and power optimization.
- Coordinate and align cross-functional teams (block design, DV, IP, PD, uArch, SW, board) to integrate blocks and resolve issues.
- Evaluate and improve integration process flow, methods, and checks.
- Troubleshoot integration, timing, and power issues and support signoff criteria and release management.
- Provide technical leadership for integration activities and mentor engineers.
Requirements
The posting does not list explicit requirements. Typical expected qualifications for this role include:
- Proven experience in ASIC/SoC chip integration on complex designs.
- Hands-on knowledge of synthesis, place-and-route flows, timing closure, and power analysis.
- Experience working with IP teams, verification, physical design, microarchitecture, software, and board engineering.
- Strong problem-solving skills and ability to drive cross-functional issue resolution.
- Experience leading technical workstreams and owning integration signoff.
Nice-to-have: experience with common EDA tools and scripting (not specified in the posting).
Education Requirements
Not specified.
About the Company
Company: Broadcom
Headquarters: Irvine, California, United States
Broadcom is a global technology leader that designs, develops, and supplies a wide range of semiconductor and infrastructure software solutions. The company is known for its innovations in wireless and broadband communications, enabling a connected world.
