Chief Engineer, Microelectronics Technology Operation

Job Title

Chief Engineer, Microelectronics Technology Operation

Role Summary

Portfolio-level Chief Engineer providing technical leadership across the Microelectronics Technology Operation (MTO). Responsible for shaping technology roadmaps, guiding multi-disciplinary engineering teams from prototype to low- to mid-volume production, and supporting business capture and customer engagement for defense-focused microelectronics and secure electronics capabilities.

Experience Level

Senior - minimum 15 years of directly relevant engineering development experience.

Responsibilities

Work at the operation level to define direction, execute complex technical programs, and develop staff and processes.

• Contribute to and maintain MTO technology development roadmaps.
• Conceptualize solutions to open-ended problems and decompose them into implementable requirements; convey design intent to teams.
• Lead hands-on, multi-disciplinary project teams to build prototypes and transition to products.
• Oversee establishment and maturation of tools, capabilities, and processes to move low-TRL prototypes toward low- to mid-volume production.
• Mentor and develop technical staff; foster innovation, rigor, and cross-team collaboration.
• Support capture, proposal development, and technical authoring (whitepapers, customer interactions).
• Coordinate with operations managers, project leads, engineers, technicians, customers, technical writers, subcontractors, and vendors.
• Work primarily at Radiance HQ in Huntsville, AL, with regular visits to Redstone Arsenal; up to ~10% travel outside the Huntsville area.

Requirements

Must-have skills and attributes for success in this role.

• US citizenship and ability to obtain and maintain an appropriate security clearance.
• Minimum 15 years of directly relevant engineering development experience.
• Hands-on working knowledge across prototype/product disciplines: embedded software, FPGA firmware, mechanical, electronics, RF, test & verification, qualification, and high-mix/low-volume production.
• Proven ability to move between strategic (big-picture) and detailed implementation tasks.
• Strong oral, written, and presentation skills for technical and non-technical audiences.
• Strong analytical, debugging, and troubleshooting skills.
• Extensive organizational-level knowledge of engineering best practices (people, processes, tools).
• Demonstrated ability to mentor and develop technical personnel.

Nice-to-have:

• Active Top Secret (or higher) security clearance.
• Advanced knowledge of embedded systems development and microelectronics packaging (3DHI, RDL, silicon interposers).
• Familiarity with DoD microelectronics supply chain and weapons systems architectures.
• Expertise in hardware security or vulnerability research, including reverse-engineering threat analysis.
• Experience working with government agencies such as Army CCDC, DARPA, AFRL, or NSA and with DoD Hardware Assurance / Anti-Tamper communities.

Education Requirements

Required: Bachelor of Science in Electrical Engineering, Computer Engineering, Aerospace Engineering, Mechanical Engineering, or a related technical field. Preferred: Master's degree or Ph.D. in a relevant technical field. The posting also references clearance expectations (ability to obtain/maintain) and a preference for active top-level clearance where available.

About the Company

Company: Radiance Technologies

Headquarters: Huntsville, AL, USA

Employee-owned engineering firm specializing in advanced technology development for national security, focusing on microelectronics and systems security, anti-tamper/protective technologies, secure packaging, and embedded systems for defense customers.