Career Accelerator Program - Packaging Engineer
Texas InstrumentsJob Title
Career Accelerator Program - Packaging Engineer
Role Summary
Entry-level Packaging Engineer in Texas Instruments' Career Accelerator Program (TMG Development), a 12-month program for new college graduates. The role supports design, development and analysis of semiconductor packaging technologies (Wirebond, Flip Chip, Modules, SiPs and advanced packages) to meet reliability, performance, miniaturization and yield targets for analog and embedded processing products.
Work is cross-functional and hands-on, supporting product qualification, production requirements, and supplier evaluations in a fast-paced engineering environment.
Experience Level
Entry-level (new college graduate). Intended for candidates just out of university; suitable for 0–2 years of experience.
Responsibilities
Typical responsibilities for this role include:
- Partner with product teams and stakeholders to design and develop internal and external semiconductor packaging solutions.
- Support product qualification and production activities to meet reliability and yield targets, and improve testability and coverage.
- Plan and execute design-of-experiments and work with material and process suppliers to evaluate and downselect materials and processes.
- Perform electrical, mechanical and thermal modeling to analyze silicon-to-package interactions and establish design rules.
- Participate in cross-functional teams during development, qualification and ramp to production.
Requirements
Key requirements and skills. Degree details are summarized in the Education Requirements section below.
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Must-have:
- Demonstrated analytical and problem-solving ability.
- Effective written and verbal communication skills and ability to collaborate in teams.
- Strong time-management and project delivery skills; ability to work in a fast-paced, changing environment and take initiative.
- Work authorization for the United States; Texas Instruments will not sponsor visas for this position.
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Nice-to-have:
- Basic understanding of statistical process control (SPC).
- Knowledge of semiconductor packaging manufacturing, assembly, reliability, materials, characterization and failure analysis.
- Experience or familiarity with modeling tools (electrical, mechanical, thermal) and design-of-experiments methods.
Education Requirements
Bachelor's degree required in Materials Science, Mechanical Engineering, Chemical Engineering, Physics, Electrical Engineering, or a related technical field. Minimum cumulative GPA 3.0/4.0. Position is targeted to new college graduates (12-month Career Accelerator Program).
About the Company
Company: Texas Instruments
Headquarters: Dallas, Texas, USA
Texas Instruments is a global semiconductor company that designs, manufactures, and sells analog and embedded processing chips for various markets including industrial, automotive, and personal electronics. The company's innovations aim to make electronics more affordable and reliable, fostering advancements in technology through each generation of semiconductors.
