Career Accelerator Program - Packaging Engineer

Job Title

Career Accelerator Program - Packaging Engineer

Role Summary

12-month new-graduate placement within TI's Career Accelerator Program (CAP) on the TMG Development team. The Packaging Engineer will design, develop and analyze semiconductor packaging technologies (wirebond, flip chip, modules, SiP) and support product qualification and production.

The role requires cross-functional collaboration with product teams and suppliers to meet reliability, yield and performance targets through modeling, experiments and material evaluation.

Experience Level

Entry-level — open to fresh graduates and candidates with up to 2 years of relevant experience.

Responsibilities

Key responsibilities include:

• Design and develop semiconductor packaging solutions (Wirebond, Flip Chip, Modules, SiPs, and advanced packages).
• Participate in cross-functional teams to support product qualification, production, reliability and yield improvement.
• Plan and execute design-of-experiments (DOE) and evaluate materials with suppliers to improve reliability and performance.
• Perform electrical, mechanical and thermal modeling to predict silicon-to-package interactions and establish design rules.
• Support testability, test coverage, failure analysis and root-cause investigations.
• Collaborate with global teams and communicate technical results to stakeholders to meet project timelines.

Requirements

Must-have and preferred skills:

• Analytical problem-solving and strong quantitative skills.
• Effective written and verbal communication; ability to work in cross-functional teams.
• Time-management skills and ability to deliver on schedule in a fast-paced environment.
• Initiative and drive for results; ability to build influential relationships.
• Preferred: basic understanding of statistical process control (SPC) and prior exposure to semiconductor packaging processes, assembly, reliability, materials, characterization, or failure analysis.
• Must be legally authorized to work in Malaysia; Texas Instruments will not sponsor visas for this position.

Education Requirements

Bachelor's degree in Material Science, Mechanical Engineering, Chemical Engineering, Physics, Electrical Engineering, or Mechatronics Engineering. The posting specifies a minimum cumulative CGPA > 3.3 and targets new college graduates (open to fresh graduates and up to 2 years of relevant experience).

About the Company

Company: Texas Instruments

Headquarters: Dallas, Texas, USA

Texas Instruments is a global semiconductor company that designs, manufactures, and sells analog and embedded processing chips for various markets including industrial, automotive, and personal electronics. The company's innovations aim to make electronics more affordable and reliable, fostering advancements in technology through each generation of semiconductors.