ATD MIHL Equipment Development Engineer

Job Title

ATD MIHL Equipment Development Engineer

Role Summary

Join Intel's Packaging Module Development team to design and optimize assembly and packaging processes and equipment that support next-generation packaging solutions. The role focuses on improving manufacturability, reliability, yield, and productivity through equipment development, qualification, and process optimization.

This is an on-site role based in Phoenix, AZ, working with cross-functional teams and external suppliers to advance packaging technologies.

Experience Level

Mid-level — experience guidance by degree: Bachelor's degree pathway typically requires 3+ years, Master's degree pathway typically requires 2+ years, PhD pathway typically requires 6+ months of relevant experience.

Responsibilities

Key responsibilities include developing equipment and processes, validating reliability, and driving continuous improvement.

• Develop and refine packaging processes and equipment to meet quality, reliability, cost, yield, and productivity targets.
• Apply Design of Experiments (DOE) and statistical methods to optimize processes; document results in technical reports.
• Design and maintain equipment to evaluate packaging technologies under simulated field conditions (heat, humidity, temperature cycles, mechanical forces).
• Ensure manufacturability of physical layouts and manage manufacturing workflow lifecycles.
• Define material specifications and collaborate with supplier quality and procurement to ensure compliance.
• Develop new techniques, tools, and quality screens to identify and mitigate packaging reliability risks.
• Set reliability benchmarks based on failure-mechanism analysis to meet customer requirements.
• Lead problem-solving activities and drive continuous improvement in equipment and processes.
• Provide technical consultation to internal teams and partners and standardize product qualification and manufacturing quality systems.

Requirements

Minimum degree-based qualifications are listed under Education Requirements. This position is not eligible for Intel immigration sponsorship.

• Proficiency in Statistical Process Control (SPC) and Design of Experiments (DOE) methodologies.
• Familiarity with mechanical drawings and Geometric Dimensioning & Tolerancing (GD&T).
• Competency with mechanical design software such as SolidWorks or AutoCAD.
• Experience designing or maintaining equipment for environmental and reliability testing.
• Ability to define material specifications and work with supplier quality and procurement.
• Strong problem-solving skills and experience driving technical improvements and risk management.

Nice-to-have:

• Proven ability to lead technical innovation and manage complex, time-sensitive projects.
• Understanding of semiconductor fabrication and packaging technologies.
• Familiarity with supply chain management for manufacturing or materials qualification.
• Experience with high-precision manufacturing methods, including stamping and CNC machining.

Education Requirements

Bachelor's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field with 3+ years of relevant experience; OR Master's degree in those fields with 2+ years of relevant experience; OR PhD in those fields with at least 6 months of relevant experience. The posting indicates these requirements may be met through a combination of industry experience, internships, coursework, or research.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.