Associate or Senior Product Yield Enhancement Development Failure Analysis Engineer (High Bandwidth Memory)
Micron TechnologyJob Title
Associate or Senior Product Yield Enhancement Development Failure Analysis Engineer (High Bandwidth Memory)
Role Summary
Join the HBM Product Development Failure Analysis (PDFA) team to support bringing next-generation High Bandwidth Memory products from design through qualification into high-volume manufacturing. The role focuses on failure analysis, root-cause identification, and driving corrective actions to improve yield, reliability, and ramp speed.
Work cross-functionally with Product, Process, Test, Quality, and Manufacturing Engineering, and apply electrical, physical, statistical, and AI-enabled analysis methods to resolve component- and system-level issues.
Experience Level
Associate or Senior level. Typical guidance: Associate-level ~2+ years experience; Senior-level typically 5+ years of relevant semiconductor failure analysis and characterization experience (senior is preferred if noted).
Responsibilities
Primary responsibilities include characterization, analysis, and cross-functional issue resolution during new product introduction and ramp.
- Perform electrical, physical, and statistical failure analysis to identify and characterize defects and failure mechanisms in HBM products.
- Analyze component- and system-level data and apply statistical techniques to determine root causes.
- Use AI and data-analytics tools to enhance failure detection, reliability learning, and yield improvement.
- Collaborate with Product, Process, Test, Quality, and Manufacturing teams to resolve fabrication, assembly, and test-related issues.
- Identify process defects, assembly-related failures, and test flow marginalities through detailed data analysis and characterization.
- Communicate technical findings and recommended corrective actions; drive issue resolution across multi-functional teams.
- Support product qualification, rapid production ramp, and continuous reliability improvements.
Requirements
Must-have technical skills and experience required for this role.
- 2+ years performing electrical and statistical failure analysis to identify failure mechanisms.
- 2+ years applying electrical and physical characterization techniques for semiconductor failure analysis.
- Practical experience with statistical methods and data-analysis tools for engineering investigations.
- Experience using AI, machine learning, or data-analytics tools to support analysis and root-cause work.
- Coursework, training, or practical experience with Python and applied statistics.
- Strong written and verbal communication skills and demonstrated ability to work in multi-functional engineering teams.
Nice-to-have:
- 5+ years of failure analysis and characterization experience (preferred for senior level).
- Hands-on experience in VLSI design, semiconductor processes, device physics, and JMP or similar statistical software.
- Proven ability to influence technical outcomes and lead cross-disciplinary issue resolution.
Education Requirements
Bachelor's degree in Electrical Engineering, Computer Engineering, Physics, Materials Science, or a related technical field is required. Relevant coursework or practical training in VLSI, semiconductor device physics, semiconductor processing, Python programming, and statistics is expected. Advanced coursework or additional experience in these areas is preferred for senior candidates.
About the Company
Company: Micron Technology
Headquarters: Boise, Idaho, USA
Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.
