Assembly Process & NPI Engineer

Job Title

Assembly Process & NPI Engineer

Role Summary

Responsible for driving and managing silicon bump and package assembly suppliers, backend processes, and related solutions to support new product introductions and production. Works cross-functionally with package design & technology, test & product engineering, production planning, quality & NPI teams and external suppliers.

Primary mission is to define and control assembly processes, monitor systems, support suppliers, and implement improvements to meet quality, delivery, cost and second-sourcing objectives.

Experience Level

Senior — experience managing advanced-node silicon bumping and multi-chip package assembly; posting indicates approximately 7–12 years of relevant experience.

Responsibilities

Key responsibilities include process ownership for bumping and package assembly, supplier management, and driving continuous improvement.

• Manage and qualify silicon bump, package assembly and substrate/back-end suppliers.
• Define assembly processes, create and maintain process documentation and process change notifications.
• Support new product introduction (NPI) activities and cross-functional project teams.
• Monitor process metrics and system performance; conduct failure analysis and root-cause investigations.
• Plan and implement process improvements, cost reduction, second-sourcing and supplier development activities.
• Coordinate with internal planning, product and test engineering teams to resolve production and quality issues.
• Travel to supplier sites or other locations as required to support delivery and qualification activities.

Requirements

Technical and behavioral requirements. Degrees and fields are summarized separately under Education Requirements.

• Must-have: Proven experience managing advanced-node silicon bumping, large-body single- and multi-chip (2.1/2.5/3D) package assembly and substrate/back-end processes and suppliers.
• Must-have: Hands-on experience with product lifecycle tasks such as bill-of-material management, process documentation and process change control.
• Must-have: Strong project management, analytical and problem-solving skills; experience with failure analysis tools and TQM practices.
• Must-have: Knowledge of industry quality systems and relevant standards; familiarity with prevailing and emerging silicon package and substrate technologies, materials and equipment.
• Must-have: Effective communicator across distributed teams; ability to travel on short notice.
• Nice-to-have: Experience with AutoCAD and familiarity with silicon & PCB fabrication and board assembly processes.

Education Requirements

PhD, Master’s, or Bachelor’s degree in Mechanical, Electrical or Electronics Engineering. The posting indicates 7–12 years of relevant industry experience alongside these degree levels.

About the Company

Company: Broadcom

Headquarters: Irvine, California, United States

Broadcom is a global technology leader that designs, develops, and supplies a wide range of semiconductor and infrastructure software solutions. The company is known for its innovations in wireless and broadband communications, enabling a connected world.