ASIC Package Design Project Manager
BroadcomJob Title
ASIC Package Design Project Manager
Role Summary
Lead and manage engineering projects delivering flip-chip BGA package designs for high-performance ASICs used in AI, networking, HPC, and 5G. Responsible for project planning, schedule and resource tracking, cross-functional coordination, and contributing to package design methodologies.
Work with a global R&D team on designs involving high-speed SerDes, HBM, DDR5, RF/Microwave, and high-power delivery.
Experience Level
Senior-level role - the posting specifies 10–12+ years of related experience depending on degree (see Education Requirements).
Responsibilities
Primary responsibilities include project planning, coordination, and development of technical methodologies.
- Create and maintain project plans for 20+ concurrent package designs (scope, schedule, resources).
- Improve and apply scheduling methodologies, task tracking, and coordination processes.
- Organize team and customer activities; communicate plans, status, next steps, and risks.
- Define and steer package technology decisions and design rules with engineering input.
- Develop and document technical methodologies for package design and verification.
- Coordinate with customers, vendors, and cross-functional internal teams.
Requirements
Must-have technical and professional skills for successful performance.
- Proven experience managing package design projects and engineering teams.
- Knowledge of package-level signal integrity (SI) and power integrity (PI) as applied to package designs.
- Experience co-designing with internal teams and external vendor designers across multiple time zones.
- Strong self-management and organizational skills.
- Technical understanding of the package-design lifecycle, substrate/package integration, and design data formats (e.g., .mcm, spreadsheets, POD/lid/substrate drawings).
- Understanding of DFx trade-offs (manufacturability, reliability, SI/PI, supply assurance).
- Experience with layout, SI/PI extraction and simulation, automation code development, and mechanical/thermal modeling.
- Project management skills and experience preparing new-business quotes.
- On-site work required: position requires working on-site 5 days a week; occasional travel may be required.
Education Requirements
Bachelor's degree plus 12+ years of related experience, or Master's degree plus 10+ years of related experience.
About the Company
Company: Broadcom
Headquarters: Irvine, California, United States
Broadcom is a global technology leader that designs, develops, and supplies a wide range of semiconductor and infrastructure software solutions. The company is known for its innovations in wireless and broadband communications, enabling a connected world.
