ASIC Package Design Engineer
BroadcomJob Title
ASIC Package Design Engineer
Role Summary
Experienced IC package-design engineer responsible for flip-chip BGA packages supporting high-speed SerDes, high-power delivery, HBM, DDR5, ADC/DAC and other advanced ASIC requirements. You'll join a worldwide R&D package engineering team focused on ASICs for AI, networking, HPC and 5G.
Experience Level
Senior level - role expects extensive industry experience (10+ years typical; see Education Requirements for degree and experience combinations).
Responsibilities
Design and deliver ASIC package solutions that meet signal integrity, power integrity, thermal, reliability and manufacturability targets.
- Lead package design for SerDes, ADC/DAC, DDR, HBM and other critical interfaces.
- Perform flip-chip BGA package layout and physical design tasks.
- Develop solutions addressing signal integrity, power delivery, thermal and reliability concerns at package level.
- Manage schedules and priorities across multiple (2+) concurrent projects.
- Serve as project technical lead and customer interface for assigned designs.
- Improve team efficiency through process development, automation, documentation and tools.
Requirements
Must-have technical skills and work conditions; preferred items called out where applicable.
- Proven experience in flip-chip BGA package design for high-performance ASICs (years guidance in Education Requirements).
- Strong understanding of package-level signal integrity and power integrity and ability to apply those principles to package designs.
- Experience collaborating across time zones and coordinating co-design with internal teams and external vendors.
- Self-management, organization, and ability to drive projects to completion.
- On-site work required: position is expected to be in-office five days per week.
- Preferred: experience with Cadence Allegro/Allegro Package Designer (APD) or equivalent package design tools.
- Preferred: familiarity with Cadence SKILL or other design-automation scripting (1+ year preferred).
Education Requirements
Bachelor of Science in Electrical Engineering (BSEE) or similar field with 12+ years of relevant flip-chip BGA package-design experience; or Master of Science in Electrical Engineering (MSEE) or similar field with 10+ years of relevant experience. Fields referenced: electrical engineering or similar technical discipline. No other certifications were specified in the posting.
About the Company
Company: Broadcom
Headquarters: Irvine, California, United States
Broadcom is a global technology leader that designs, develops, and supplies a wide range of semiconductor and infrastructure software solutions. The company is known for its innovations in wireless and broadband communications, enabling a connected world.
