ASIC Package Design Engineer
BroadcomJob Title
ASIC Package Design Engineer
Role Summary
Design and develop flip-chip BGA packages for high-performance ASICs used in AI, networking, HPC, and 5G infrastructure. Work with a global R&D team to deliver package structures that meet signal-integrity, power-delivery, thermal, manufacturability, and reliability requirements.
Experience Level
Senior - typically requires 10–12+ years of relevant experience in IC package design.
Responsibilities
Accountable for end-to-end package design and delivery across multiple projects.
- Lead ASIC package design focusing on signal integrity, power integrity, manufacturability, reliability, and thermal performance.
- Design critical structures for SerDes, ADC/DAC, DDR, HBM and other high-speed interfaces.
- Perform physical package design and layout.
- Manage project schedules, prioritize tasks, and track progress across concurrent projects.
- Serve as project manager and customer interface for package design efforts.
- Improve efficiency via process development, automation, and documentation.
- Collaborate with internal and external teams across multiple time zones for co-design and integration.
Requirements
Must-have technical skills and experience; preferred items listed separately.
- Extensive experience in flip-chip BGA package design, including high-speed interfaces (SerDes, DDR, HBM, ADC/DAC).
- Proven knowledge of package-level signal integrity and power integrity analysis and application.
- Hands-on physical design/layout experience for IC packages.
- Strong project-management skills: scheduling, prioritization, and cross-project coordination.
- Ability to collaborate effectively with teams across multiple time zones and act as a customer-facing technical lead.
- Strong self-management and organizational skills.
- Preferred: experience with Cadence APD/Allegro package tools.
- Preferred: design-automation coding experience (Cadence SKILL or similar) for process automation.
Education Requirements
Requires a Bachelor of Science in Electrical Engineering (BSEE) or similar field with ~12 years of relevant flip-chip BGA package design experience, or a Master of Science in Electrical Engineering (MSEE) with ~10 years of relevant experience. Fields: Electrical Engineering or closely related technical disciplines.
About the Company
Company: Broadcom
Headquarters: Irvine, California, United States
Broadcom is a global technology leader that designs, develops, and supplies a wide range of semiconductor and infrastructure software solutions. The company is known for its innovations in wireless and broadband communications, enabling a connected world.
