APTM Yield Analysis/Device Engineer
Join the Advanced Packaging Technology and Manufacturing (APTM) Yield Group to drive yield, device, and defect improvement across advanced packaging technologies. The role focuses on analyzing large datasets, applying statistical and machine-learning techniques, and delivering actionable recommendations to improve manufacturing processes, test content, and inline metrology.
Work closely with process, integration, test, and product teams to support technology development, transfer, and high-volume manufacturing (HVM) ramps.
Senior — typically 6+ years relevant experience with a Bachelor’s degree, 4+ years with a Master’s, or 2+ years with a PhD (per employer minimums).
Primary responsibilities include data-driven yield and device analysis, cross-functional problem solving, and delivering improvements that enable successful technology ramps.
Key must-have and preferred skills for effective performance in this role.
Minimum: Bachelor’s degree plus 6+ years relevant experience, or Master’s degree plus 4+ years, or PhD plus 2+ years. Relevant fields listed by the employer include Materials Science and Engineering, Mechanical Engineering, Computer Science, Information Systems, Chemical Engineering, Electrical Engineering, Chemistry, Physics, or a closely related technical field. Equivalent practical experience is acceptable per the posting.
Company: Intel Corporation
Headquarters: Santa Clara, California, USA
Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.
