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APTM Yield Analysis/Device Engineer

Intel Corporation
May 06, 2026
Full-time
Remote friendly (Albuquerque, New Mexico, United States)
United States
$164,470 - $232,190 USD yearly
Test Engineering Jobs, Level - Senior

Job Title

APTM Yield Analysis/Device Engineer

Role Summary

Join the Advanced Packaging Technology and Manufacturing (APTM) Yield Group to drive yield, device, and defect improvement across advanced packaging technologies. The role focuses on analyzing large datasets, applying statistical and machine-learning techniques, and delivering actionable recommendations to improve manufacturing processes, test content, and inline metrology.

Work closely with process, integration, test, and product teams to support technology development, transfer, and high-volume manufacturing (HVM) ramps.

Experience Level

Senior — typically 6+ years relevant experience with a Bachelor’s degree, 4+ years with a Master’s, or 2+ years with a PhD (per employer minimums).

Responsibilities

Primary responsibilities include data-driven yield and device analysis, cross-functional problem solving, and delivering improvements that enable successful technology ramps.

  • Analyze large structured and unstructured datasets; apply statistical methods and machine-learning techniques to extract insights.
  • Identify root causes of yield and device failures and recommend corrective actions across process, test, and metrology.
  • Develop and prioritize the yield improvement roadmap and drive execution across organizational boundaries.
  • Correlate electrical and physical fails; apply knowledge of FIFA, DFT, sort/test, integration/process flow, and datamining.
  • Assess inline defect metrology capabilities and defect detection systems; recommend measurement and inspection changes.
  • Prepare clear technical reports and presentations summarizing yield and device health for stakeholders.
  • Collaborate with upstream, downstream, and cross-functional partners to enable technology development, transfer, and HVM ramp; some domestic and international travel may be required.

Requirements

Key must-have and preferred skills for effective performance in this role.

  • Must-have: Hands-on data analysis experience using tools such as JMP or Python and other data engineering/analytics tools.
  • Must-have: Strong statistical analysis skills and experience with data visualization and database manipulation.
  • Must-have: Familiarity with yield-analysis concepts and workflows: FIFA, DFT, sort/test, integration/process flow, and datamining.
  • Must-have: Knowledge of inline defect metrology and defect detection systems used in manufacturing.
  • Must-have: Proven ability to influence cross-functional teams, communicate technical findings clearly, and lead problem-resolution activities.
  • Must-have: Ability to work autonomously, tolerate ambiguity, and travel as needed.
  • Nice-to-have: Practical experience applying machine learning techniques to manufacturing or test data.
  • Nice-to-have: Understanding of product design, circuits, or architecture as they relate to yield analysis.

Education Requirements

Minimum: Bachelor’s degree plus 6+ years relevant experience, or Master’s degree plus 4+ years, or PhD plus 2+ years. Relevant fields listed by the employer include Materials Science and Engineering, Mechanical Engineering, Computer Science, Information Systems, Chemical Engineering, Electrical Engineering, Chemistry, Physics, or a closely related technical field. Equivalent practical experience is acceptable per the posting.


About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.

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Date Posted: 2026-05-06