APTD SWA Module Engineer On-Shift (Dayshift)
Work on Intel's Advanced Packaging Technology Development (APTD) Substrate and Wafer Assembly (SWA) team to provide on-shift factory support for substrate packaging production. The role focuses on responding to equipment, process, and product issues in real time to maintain continuous 24x7 lot flow and support new tool enablement and production quality.
Entry-level / College Grad. The posting specifies bachelor's-level candidates with limited experience or master's-level candidates with no prior experience (see Education Requirements for details).
Primary on-shift duties to sustain manufacturing operations and resolve process/product issues.
Must-have skills and workplace requirements; preferred skills listed separately.
Bachelor's degree in Materials Engineering, Mechanical Engineering, Chemical Engineering, Chemistry, Physics, or a related discipline with at least 6 months of relevant experience; OR Master's degree in those fields with 0 years of relevant experience. No certifications specified. Equivalent practical experience is not listed as an alternative in the posting.
Company: Intel Corporation
Headquarters: Santa Clara, California, USA
Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.
