Applications Engineer — 3D-IC Solutions Sales (Japan)

Job Title

Applications Engineer — 3D-IC Solutions Sales (Japan)

Role Summary

Drive technical design wins for Siemens EDA 3D‑IC solutions (Innovator3D Integrator/Layout and Calibre 3DIC products) for key accounts primarily in Japan. The role is sales‑facing and technical: you will perform demonstrations, benchmarks, and solution engineering to win customer adoption.

Based in Hsinchu with a hybrid work arrangement; regular travel to customer sites in Japan and international travel are required.

Experience Level

Mid-level — typically professionals with practical semiconductor industry experience (roughly 3–7 years; this role expects demonstrated domain experience).

Responsibilities

Primary responsibilities include technical support for sales and account strategy focused on 3D‑IC solutions.

• Secure technical design wins for Siemens 3D‑IC offerings.
• Prepare and deliver technical presentations, product demonstrations, and benchmarks.
• Develop technical solutions and account strategies with sales teams to grow market share.
• Provide onsite customer support in Japan and act as a technical liaison for key accounts.
• Collaborate with global peers and report technical status to internal and external stakeholders.
• Travel internationally as required to support customers and partners.

Requirements

Must-have technical skills, languages, and work traits.

• Knowledge of IC and packaging data formats: Verilog, LEF/DEF, GDS, OASIS, ODB++.
• Familiarity with 2.5D/3D‑IC integration technologies (for example, TSMC 3DFabric, Intel EMIB/Foveros).
• General understanding of Chiplet‑based design challenges and methodologies.
• Practical scripting skills in Python, Tcl, Perl, or similar.
• Solid working knowledge of both Windows and Linux operating systems.
• Proficiency with Microsoft Word, Excel, and PowerPoint.
• Professional working proficiency in Japanese and English.
• Willingness and ability to travel to Japan for onsite customer meetings and to travel internationally as needed.

Nice-to-have:

• Prior customer-facing experience.
• Familiarity with 2.5D/3D‑IC EDA cockpit solutions (e.g., Siemens Innovator3D Integrator, Cadence Integrity System Planner, Synopsys 3DIC Compiler).
• Knowledge of IC package/interposer layout methodologies and EDA tools (e.g., Cadence APD).
• Direct experience with Siemens Calibre solutions (Calibre DRC/LVS and/or Calibre 3DSTACK).

Education Requirements

Bachelor's or Master's degree in Electrical/Electronic Engineering (BSEE or MSEE) is specified. The role also expects demonstrated semiconductor industry experience (the posting references approximately four years of practical experience).

About the Company

Company: Siemens

Headquarters: Munich, Germany

Siemens EDA is a leading global provider of Electronic Design Automation (EDA) products and systems. Their innovative solutions enable companies to enhance the development of electronic products efficiently and effectively, keeping pace with the complex demands of technology and physics. Siemens is committed to delivering advanced workflow solutions that integrate both EDA and MCAD tools for multi-domain design and manufacturing in the semiconductor industry.