Applications Engineer, 3D-IC Solutions Sales

Job Title

Applications Engineer, 3D-IC Solutions Sales

Role Summary

Responsible for securing technical design wins for Siemens EDA 3D-IC solutions (Innovator3D Integrator/Layout and Calibre 3DIC family) through technical presentations, product demonstrations, benchmarks, and account strategy support.

Work with global sales and engineering teams to support key accounts (primarily in Japan) and provide onsite customer technical support; international travel is required.

Experience Level

Mid-level — requires approximately 4+ years of demonstrated experience in the semiconductor industry.

Responsibilities

Primary responsibilities include:

• Drive technical design wins for Siemens 3D-IC and Calibre product offerings.
• Deliver technical presentations and product demonstrations to customers and stakeholders.
• Run benchmarks and technical evaluations to validate solution benefits.
• Develop solution proposals and account strategies to increase market share.
• Support key accounts in the territory (primarily Japan) and act as technical liaison with global teams.
• Provide onsite customer support during planned visits; travel internationally as required.
• Communicate status and technical findings to internal teams and customers.

Requirements

Must-have skills and experience (concise):

• Knowledge of IC and packaging data formats: Verilog, LEF/DEF, GDS, OASIS, ODB++.
• Familiarity with 2.5D/3D-IC integration technologies (e.g., TSMC 3DFabric, Intel EMIB/Foveros).
• General understanding of chiplet-based design challenges and methodologies.
• Practical scripting skills in Python, Tcl, Perl, or similar; strong familiarity with Windows and Linux.
• Proficient with Microsoft Word, Excel, and PowerPoint.
• Professional working proficiency in Japanese and English.
• Willingness and ability to travel domestically and internationally, including periodic travel to Japan.

Nice-to-have:

• Prior customer-facing or field-application experience.
• Familiarity with 2.5D/3D-IC EDA cockpit tools (e.g., Siemens Innovator3D IC Integrator, Cadence Integrity System Planner, Synopsys 3DIC Compiler).
• Knowledge of IC package/interposer layout methodologies and tools (e.g., Cadence APD).
• Direct experience with Siemens Calibre solutions (Calibre DRC/LVS, Calibre 3DSTACK).

Education Requirements

Bachelor's (BSEE) or Master's (MSEE) in Electrical/Electronic Engineering with at least 4 years of demonstrated semiconductor industry experience.

About the Company

Company: Siemens

Headquarters: Munich, Germany

Siemens EDA is a leading global provider of Electronic Design Automation (EDA) products and systems. Their innovative solutions enable companies to enhance the development of electronic products efficiently and effectively, keeping pace with the complex demands of technology and physics. Siemens is committed to delivering advanced workflow solutions that integrate both EDA and MCAD tools for multi-domain design and manufacturing in the semiconductor industry.