Skip to main content
GlobalFoundries logo

APL Quantum Intern (Summer 2027)

GlobalFoundries
October 13, 2026
Full-time
On-site
Malta, New York, United States
$20 - $40 USD hourly
Process Engineering Jobs, Level - Entry or Early Career

Job Title

APL Quantum Intern (Summer 2027)

Role Summary

The intern will support development of quantum advanced packaging processes, including wafer-to-wafer and die-to-wafer hybrid bonding, TSV/TOV, and interposer work. The role works with engineering teams to run experiments, analyze results, model processes, and support daily integration and process-development activities.

Experience Level

Entry-level internship for university students (sophomore or above). Designed as an entry pipeline to semiconductor process and packaging engineering.

Responsibilities

Contribute to experimental execution, data analysis, and process-development tasks under engineering supervision.

  • Plan and perform design of experiments (DOEs) using internal semiconductor tools and partner equipment.
  • Collect, analyze, and interpret engineering data from experiments and process optimizations.
  • Develop or support process models to improve understanding of advanced packaging performance.
  • Support daily integration, process-development activities, documentation, and engineering problem solving.
  • Communicate experimental results, technical findings, and recommended next steps to project stakeholders.
  • Perform work safely and support Environmental, Health, Safety & Security programs.

Requirements

Key must-have and preferred non-education qualifications.

  • Ability to work at least 40 hours per week during the internship.
  • Travel up to 10% as required.
  • English fluency (written and verbal).
  • Ability to work safely and comply with EHS&S requirements.

Preferred (nice-to-have):

  • Prior related internship or co-op experience.
  • Leadership experience in projects, competitions, or workplace settings.
  • Interest in using AI tools and emerging technologies to improve productivity.
  • Project management, planning, and strong written/verbal communication skills.
  • Experience with advanced semiconductor packaging, hybrid bonding, TSV/TOV, interposers, DOEs, or engineering data analysis.
  • Availability for a six-month co-op assignment is preferred.

Education Requirements

At least a sophomore at time of application and actively pursuing a Bachelor’s or Master’s degree in Engineering or a related field through an accredited program. Minimum overall GPA of 3.0 and in good academic standing. Preferred: currently pursuing a PhD in Engineering or related field.


About the Company

Company: GlobalFoundries

Headquarters: Saratoga Springs, New York, USA

GlobalFoundries is a leading contract manufacturer for the global semiconductor industry, with facilities in multiple countries, including the USA. The company develops a broad portfolio of semiconductor technologies and employs around 13,000 people worldwide. GlobalFoundries focuses on enhancing competitiveness in specialized application solutions and fostering innovation in mobile communications, consumer electronics, and automotive applications.

GlobalFoundries logo

Date Posted: 2026-10-08