ALD Thin Film Process Development Engineer

Job Title

ALD Thin Film Process Development Engineer

Role Summary

Process development engineer on the Lehi, UT Advanced Technology Development team responsible for developing and qualifying thin-film deposition processes for advanced semiconductor logic and memory. The role spans early R&D, pilot work, and transfer to full-scale manufacturing.

Experience Level

Mid-level - requires 5+ years of relevant experience in 300mm advanced (<32nm) logic or advanced memory device technologies.

Responsibilities

Deliver process solutions, lead integration and equipment selection, and support manufacturing transfer and yield improvement on 300mm deposition platforms.

• Develop new processes and define processing/equipment specifications and manufacturing methods for advanced semiconductor applications.
• Influence process integration and translate roadmap requirements into pathfinding and development projects.
• Design and analyze experiments (DOE), apply SPC, and use statistical methods to identify and mitigate yield loss.
• Lead or support projects on equipment selection, chemistry development, automation, and novel manufacturing approaches.
• Provide technical support in manufacturing and drive process/equipment changes to improve efficiency, capability, and yield.
• Partner with equipment suppliers and vendors to define and execute development roadmaps.
• Work across 300mm deposition platforms including single-wafer ALD and CVD systems.

Requirements

Must-have qualifications and technical skills required to perform the role.

• 5+ years relevant experience in 300mm advanced (<32nm) logic or advanced memory device technologies.
• Working knowledge of process development and characterization for thin-film processing equipment: CVD, PE-CVD, single-wafer ALD.
• Experience applying statistical process control, Design of Experiments (DOE), and data analysis to drive process improvements.
• Strong supplier engagement and vendor-management skills.
• Model-based problem solving, engineering change control, and process release strategy experience.
• Ability to support manufacturing transfer and cross-functional collaboration.

Nice-to-have:

• Experience with RMG products and multiple 300mm deposition platforms (dielectric, high-K, metals).
• Hands-on experience with single-wafer ALD platforms (e.g., ASM XP4, XP8) and batch ALD.
• Familiarity with 300mm thermal/RTA and laser anneal systems, HKMG, and silicon photonics.
• Direct R&D experience in 300mm semiconductors and device physics/reliability understanding.
• Strong communication, teamwork, and project delivery skills.

Education Requirements

Master's degree in Chemical Engineering, Chemistry, Electrical Engineering, Materials Science Engineering, Mechanical Engineering, Physics, or a related field (Master's degree is specified as the required degree level).

About the Company

Company: Texas Instruments

Headquarters: Dallas, Texas, USA

Texas Instruments is a global semiconductor company that designs, manufactures, and sells analog and embedded processing chips for various markets including industrial, automotive, and personal electronics. The company's innovations aim to make electronics more affordable and reliable, fostering advancements in technology through each generation of semiconductors.