Advanced Packaging Technology Development Substrates Module Engineer (Nightshift)

Job Title

Advanced Packaging Technology Development Substrates Module Engineer (Nightshift)

Role Summary

The Module Engineer On Shift provides real-time factory support to maintain continuous 24/7 manufacturing operations for substrate development and advanced packaging. The role supports equipment, process, and product issues, lot movement, new tool enablement, and production recoveries on a night shift.

Experience Level

Mid-level. Typical background: 1+ years of relevant manufacturing or engineering experience (see Education Requirements for degree options that alter experience expectations).

Responsibilities

Accountable for on-shift operational support, troubleshooting, documentation, and cross-functional communication to maintain production flow and quality.

• Receive and review shift pass-downs and align priorities with management.
• Provide real-time support for equipment, process, and product issues; recover from equipment errors.
• Execute non-standard procedures; perform inspections and imaging on substrate panels to collect process and development data.
• Write and update specifications, procedures, and Requests for Change (RFCs).
• Communicate issues and updates with tool owners, process owners, and cross-functional partners.
• Document all shift activities and provide detailed pass-downs to incoming shifts.
• Support new tool enablement, lot disposition activities, and process troubleshooting efforts.
• Maintain compliance with safety, quality, and operational standards while working nights on-site.

Requirements

Must-have technical skills and work expectations; education details are in the Education Requirements section below.

• Proficiency in statistical data analysis, process characterization, and manufacturing quality systems.
• Strong problem-solving and troubleshooting skills in a production environment.
• Effective verbal and written communication; ability to document activities clearly.
• Ability to adapt to changing priorities and work independently with minimal supervision.
• Availability to work night shift schedule (Shift 4: PM–AM Sun–Tues and alternating Saturday nights) and on-site presence.
• Familiarity with semiconductor manufacturing or packaging substrate processes is strongly preferred.
• Must be eligible to work in the U.S.; this position is not eligible for immigration sponsorship.

Education Requirements

Minimum: Bachelor's degree in Materials Engineering, Mechanical Engineering, Chemical Engineering, Chemistry, Physics, or a related discipline with 1+ years relevant experience; OR Master's degree in those fields with 0 years relevant experience. The posting accepts related technical disciplines. (No other certifications or alternative-equivalent-experience language was specified.)

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.