Advanced Packaging Technology Development Process Integration Engineer

Job Title

Advanced Packaging Technology Development Process Integration Engineer

Role Summary

Join the Advanced Packaging Technology and Manufacturing (APTM) team to develop and integrate advanced packaging process solutions for base die manufacturing. The role coordinates process modules, device engineering, yield, reliability, and manufacturing to enable upcoming packaging technology nodes.

This is an on-site engineering role based in Albuquerque, NM focused on taking process development from concept through qualification and transfer to high-volume manufacturing.

Experience Level

Mid-level. Typical experience profile: Bachelor's +3 years, Master's +2 years, or PhD with no experience (as listed in minimum qualifications).

Responsibilities

Primary responsibilities center on process integration, yield and reliability closure, and technology transfer to manufacturing.

• Lead development and integration of advanced packaging technology nodes in support of the APTM roadmap.
• Coordinate cross-functional activities with process module teams, device engineering, yield, reliability, and external partners.
• Own defect, yield, reliability, and device entitlement issues; drive root-cause analysis and corrective actions using data-driven methods.
• Lead process development projects from concept through qualification, ensuring manufacturability and technical rigor.
• Support Process Readiness Initiative (PRI) activities and manage transfer-readiness checklists for successful scale-up.
• Identify and implement value-engineering opportunities to reduce cost while maintaining performance.
• Collaborate with manufacturing teams to ensure stable transfers and continuous improvement post-transfer.

Requirements

Must-have technical skills and experience required for initial consideration. Preferred items are noted where applicable.

• Experience with process integration, process development, yield analysis, or quality management in high-volume semiconductor manufacturing (must).
• Knowledge of semiconductor advanced packaging techniques and process flows (must).
• Ability to perform data-driven root-cause analysis and implement sustainable corrective actions (must).
• Experience with technology transfer, process qualification, and production readiness activities (must).
• Strong cross-functional collaboration and communication skills; able to present technical concepts to varied audiences (must).
• Problem-solving mindset, adaptability in fast-paced environments, and attention to detail (must).
• Preferred: experience with value engineering and identifying cost-effective process solutions.

Education Requirements

Bachelor's degree in Engineering, Materials Science, Physics, or a related field with 3+ years relevant experience; or Master's degree in one of these fields with 2+ years relevant experience; or PhD in these fields (no experience required). Equivalent practical experience may be considered where stated.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.