Advanced Packaging Technology Development Engineer - Advanced PKG Stacking
Micron TechnologyJob Title
Advanced Packaging Technology Development Engineer - Advanced PKG Stacking
Role Summary
Responsible for developing and qualifying advanced semiconductor packaging processes (stacking, flip‑chip, hybrid bonding) and materials, establishing DOE samples, analyzing results, and transferring processes from technology development to high‑volume manufacturing.
Works cross‑functionally with materials, bumping, PI, NPI, quality, and manufacturing teams to meet development milestones and customer requirements.
Experience Level
Mid-level. Years of experience not specified; typically 3–7 years in packaging or related process development is expected.
Responsibilities
Key duties include process development, characterization, and transfer to production.
- Research and evaluate new packaging technologies and materials (flip chip, TCB, hybrid bonding).
- Define resource needs and development plans to enable new technology adoption.
- Design, execute, and analyze DOE experiments; build samples and interpret data.
- Troubleshoot process issues and drive yield and efficiency improvements.
- Prepare documentation and perform activities required for transfer from TD to HVM.
- Monitor process stability using FDC, SPC, and test results.
- Collaborate cross‑functionally with materials, bumping, PI, NPI, quality, and manufacturing teams.
- Apply AI, data analytics, and automation to accelerate development, yield improvement, and failure analysis.
Requirements
Must-have technical and behavioral skills; education listed separately.
- Strong technical problem‑solving and data analysis skills.
- Experience with DOE methodology and sample build for process characterization.
- Knowledge of flip‑chip, stacking, hybrid bonding processes, or related packaging equipment and materials.
- Self‑motivated; able to work independently and manage multiple technical tasks in a fast‑paced environment.
- Excellent written and verbal communication; fluent in English.
Nice-to-have:
- Experience applying AI, data analytics, or automation tools to process development or failure analysis.
Education Requirements
Master's degree in Engineering (materials science, mechanical, chemical) or a degree in Physics or Chemistry.
About the Company
Company: Micron Technology
Headquarters: Boise, Idaho, USA
Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.
