Advanced Packaging Supplier Technology Development Program Manager

Job Title

Advanced Packaging Supplier Technology Development Program Manager

Role Summary

Program manager responsible for delivering on-time supplier capacity expansion and qualification for advanced heterogeneous packaging (EMIB-T). Works with suppliers, internal integration, and process teams to scope manufacturing, qualify tools and processes, and enable production ramp.

This hands-on role requires close supplier engagement, cross-functional coordination, and regular international travel to validate progress and drive milestones.

Experience Level

Mid-level — requires technical program management experience. Hiring guidelines: PhD + 3+ years relevant experience, or Master’s + 5+ years relevant experience; candidates typically have multiple years working with semiconductor packaging or substrate processes.

Responsibilities

The core responsibilities include:

• Define HVM process flows, select process tools, and plan production line qualifications with TD teams and suppliers.
• Manage CapEx-driven capacity expansion projects from planning through production ramp, including schedule, budget, and milestone tracking.
• Create and drive yield-improvement and qualification plans; monitor ramp indicators and resolve technical and logistical issues.
• Facilitate capability transfer from internal pilot lines to supplier lines and close supplier knowledge gaps.
• Maintain supplier milestone dashboards and provide regular status and risk updates to stakeholders.
• Conduct on-site supplier visits and international travel to validate progress and drive milestone execution.

Requirements

Must-have qualifications and skills:

• Demonstrated experience delivering integrated process, materials, chemistry, and/or tool hardware development and customer qualification milestones on time.
• At least 2 years experience with advanced semiconductor packaging/substrates and managing cross-functional teams across time zones and cultures.
• Strong written and verbal communication and stakeholder management skills; ability to influence in matrixed organizations.
• Practical knowledge of process building blocks (component embedding, laser drilling, dielectric lamination, lithography, multi-metal electrolytic plating, defect inspection, electrical test) and their interactions.
• Familiarity with DOE, PCS, and SPC methodologies.
• Bias for action, strategic leadership, tolerance for ambiguity, and hands-on supplier engagement skills.
• Willingness to travel internationally several times per year.

Education Requirements

PhD in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Organic Chemistry, Polymer Engineering, or a relevant field plus 3+ years of relevant experience; OR Master’s degree in those fields plus 5+ years of relevant experience.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.