Advanced Packaging Singulation Module Engineering Manager
Intel CorporationJob Title
Advanced Packaging Singulation Module Engineering Manager
Role Summary
Lead an engineering team that supports high-volume manufacturing for advanced packaging singulation modules. Responsible for process development, technology transfer, ramp activities, and improving manufacturing quality, throughput, and cost.
Drive operational excellence and build engineering capability to enable reliable, high-volume production of next-generation packaging technologies.
Experience Level
Senior-level manager. Typical guidance: at least 6+ years of relevant engineering experience (see Education Requirements for degree equivalencies).
Responsibilities
Manage daily operations and lead technical and process initiatives to enable successful production ramps.
- Lead and mentor module and manufacturing operations engineers to support high-volume manufacturing.
- Manage maintenance, process engineering prioritization, yield improvement, and efficiency efforts.
- Recommend and oversee equipment and process modifications to improve production efficiency and output.
- Plan and direct process and hardware development to enable manufacturing of new device architectures.
- Oversee installation, qualification, and ramping of Early Tool Sets and production tools during factory ramps.
- Drive continuous improvement in safety, quality, throughput, and cost.
- Coordinate technology transfer across sites through training, auditing, and matched processing.
- Set clear goals, maintain accountability, manage performance, and foster an inclusive team culture.
Requirements
Minimum and preferred qualifications for initial consideration. See Education Requirements below for degree and equivalency details.
- Minimum: 6+ years of relevant engineering experience; reduced experience thresholds may apply with advanced degrees (see Education Requirements).
- Experience in process characterization and process improvement within a manufacturing environment.
- Knowledge of good manufacturing practices (GMP) and lean manufacturing principles.
- Proven experience managing engineering teams and delivering manufacturing results.
- Experience with technology transfer, factory ramp activities, tool qualification, and working with vendors.
- Preferred: strong background in advanced packaging singulation processes, strategic planning, vendor collaboration, and strong communication/influencing skills.
Education Requirements
Required: Bachelor's (BS) in engineering, materials science, physics, or a related technical field. The posting also references Master's and PhD as acceptable. Equivalent experience language: 6+ years of experience with a Bachelor's degree, 4+ years with a Master's degree, or 2+ years with a PhD.
About the Company
Company: Intel Corporation
Headquarters: Santa Clara, California, USA
Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.
