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Advanced Packaging Process Integration Engineer

Intel Corporation
October 2, 2026
Full-time
On-site
Penang, MY
Process Engineering Jobs, Level - Mid-Career

Job Title

Advanced Packaging Process Integration Engineer

Role Summary

Responsible for process integration, yield improvement, and defect reduction for advanced semiconductor packaging technologies. Works with cross-functional teams to analyze process data, implement corrective actions, and support new technology introduction and production ramp-up.

This role requires on-site presence in Penang or Kulim, Malaysia and contributes to manufacturing readiness and yield optimization for advanced packaging lines.

Experience Level

Mid-level. Typical candidate has about 3–7 years of relevant semiconductor process experience; exact minimum varies by degree and background.

Responsibilities

Key responsibilities include process monitoring, data-driven improvement, and supporting production integration.

  • Develop and refine process integration strategies for advanced packaging technologies in collaboration with cross-functional teams.
  • Monitor and analyze yield performance; identify root causes and implement corrective actions to improve production outcomes.
  • Develop and maintain process control systems to ensure manufacturing consistency and reliability.
  • Design experiments and analyze test-run data to drive process enhancements and resolve technical issues.
  • Support continuous improvement initiatives to optimize workflows and reduce cycle times.
  • Enable new technology introduction and production ramp-up by integrating novel processes into manufacturing environments.

Requirements

Essential technical skills and practical experience required for the role. Education requirements are summarized below under Education Requirements.

  • Must-have: Experience with statistical process control and yield analysis.
  • Must-have: Proficiency in data analysis using Python, MATLAB, or comparable statistical tools.
  • Must-have: Practical experience with advanced packaging technologies or semiconductor manufacturing process integration.
  • Must-have: Knowledge of experimental design and failure-analysis techniques.
  • Nice-to-have: Project management familiarity and ability to prioritize tasks in a fast-paced production environment.
  • Nice-to-have: Strong communication and collaboration skills; demonstrated ability to solve complex technical challenges.

Education Requirements

Bachelor's degree in Materials Science, Chemical Engineering, Electrical Engineering or a related technical field with ~4+ years of relevant process integration experience; or Master's degree in a relevant field with ~3+ years of related experience; or PhD in a relevant field (entry with no prior professional experience acceptable per posting). Specific degree and years-of-experience requirements vary by candidate level.


About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.

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Date Posted: 2026-10-02