Advanced Packaging Process Integration Engineer
Intel CorporationJob Title
Advanced Packaging Process Integration Engineer
Role Summary
Responsible for process integration, yield improvement, and defect reduction for advanced semiconductor packaging technologies. Works with cross-functional teams to analyze process data, implement corrective actions, and support new technology introduction and production ramp-up.
This role requires on-site presence in Penang or Kulim, Malaysia and contributes to manufacturing readiness and yield optimization for advanced packaging lines.
Experience Level
Mid-level. Typical candidate has about 3β7 years of relevant semiconductor process experience; exact minimum varies by degree and background.
Responsibilities
Key responsibilities include process monitoring, data-driven improvement, and supporting production integration.
- Develop and refine process integration strategies for advanced packaging technologies in collaboration with cross-functional teams.
- Monitor and analyze yield performance; identify root causes and implement corrective actions to improve production outcomes.
- Develop and maintain process control systems to ensure manufacturing consistency and reliability.
- Design experiments and analyze test-run data to drive process enhancements and resolve technical issues.
- Support continuous improvement initiatives to optimize workflows and reduce cycle times.
- Enable new technology introduction and production ramp-up by integrating novel processes into manufacturing environments.
Requirements
Essential technical skills and practical experience required for the role. Education requirements are summarized below under Education Requirements.
- Must-have: Experience with statistical process control and yield analysis.
- Must-have: Proficiency in data analysis using Python, MATLAB, or comparable statistical tools.
- Must-have: Practical experience with advanced packaging technologies or semiconductor manufacturing process integration.
- Must-have: Knowledge of experimental design and failure-analysis techniques.
- Nice-to-have: Project management familiarity and ability to prioritize tasks in a fast-paced production environment.
- Nice-to-have: Strong communication and collaboration skills; demonstrated ability to solve complex technical challenges.
Education Requirements
Bachelor's degree in Materials Science, Chemical Engineering, Electrical Engineering or a related technical field with ~4+ years of relevant process integration experience; or Master's degree in a relevant field with ~3+ years of related experience; or PhD in a relevant field (entry with no prior professional experience acceptable per posting). Specific degree and years-of-experience requirements vary by candidate level.
About the Company
Company: Intel Corporation
Headquarters: Santa Clara, California, USA
Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.
