Advanced Packaging Lithography Development Manager

Job Title

Advanced Packaging Lithography Development Manager

Role Summary

Manage lithography module development for next-generation advanced packaging (Foveros Direct) within Intel Foundry. Direct a team of process engineers, drive patterning flow definition and process implementation, and coordinate with integration and manufacturing to enable high-volume production.

Experience Level

Senior-level. Typical experience: 6+ years with a Master’s degree or 5+ years with a PhD in a relevant technical field (see Education Requirements).

Responsibilities

Lead technical and program delivery for lithography modules and integrate development work into manufacturing.

• Lead and manage a team of process engineers; set goals, manage performance, and coach technical staff.
• Define long-term process roadmaps and strategies to meet future packaging requirements.
• Develop and execute project schedules; track milestones and deliverables across cross-functional teams.
• Drive lithography module yield improvement and defect-reduction programs.
• Partner with process integration and manufacturing operations to enable technology transfer to high-volume manufacturing.
• Provide hands-on technical direction in patterning flow and process optimization.

Requirements

Must-have technical skills and experience required for initial consideration, followed by preferred qualifications.

• Must-have: Deep expertise with scanner/stepper systems (ASML, Canon, Nikon) and/or track equipment.
• Must-have: Extensive experience in lithography process development, optimization, and yield enhancement for advanced packaging.
• Must-have: Project management experience, including schedule development and cross-functional delivery.
• Must-have: Experience driving manufacturing readiness and technology transfer to production environments.

• Preferred / Nice-to-have: Proven ability to build and lead high-performing teams and foster inclusive culture.
• Preferred: Experience with vendor relations, material quality assessment, and supplier performance management.
• Preferred: Strong knowledge of Design of Experiments (DOE), problem-solving methodologies, and package interconnect technologies.

Education Requirements

Master's or PhD in Physics, Electrical Engineering, Materials Science, Mechanical Engineering, or a related field. Minimum experience expectations: 6+ years with a Master’s degree or 5+ years with a PhD.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.