Advanced Packaging Flagship Curriculum Internship Program (Intern)

Job Title

Advanced Packaging Flagship Curriculum Internship Program (Intern)

Role Summary

Hands-on internship within Intel Foundry's advanced packaging group based at the Kulim site. The intern will work with engineering teams to run lab-scale experiments, troubleshoot equipment, analyze processes, and support research and development activities aligned to packaging technology roadmaps.

Work is on-site and focused on practical process development, characterization, and documentation to support manufacturing and R&D goals.

Experience Level

Entry-level internship targeted at undergraduate students; no prior professional years-of-experience required.

Responsibilities

Key responsibilities include experimental work, analysis, and supporting engineering teams.

• Conduct literature surveys and technical assessments to inform process improvements.
• Perform materials characterization and apply Design of Experiments (DOE) to validate hypotheses.
• Design, develop, and execute lab-scale experiments to investigate process mechanics and improvements.
• Use computational tools (e.g., finite element analysis, computational fluid dynamics) to analyze and refine process designs.
• Document experimental methods, results, and technical findings clearly for engineering and manufacturing audiences.
• Collaborate with engineering teams to troubleshoot equipment and implement process improvements.

Requirements

Essential practical skills and workplace expectations. Education specifics are listed under Education Requirements below.

• Basic hands-on laboratory skills and familiarity with materials characterization techniques.
• Practical knowledge of Design of Experiments (DOE) methodology.
• Familiarity with computational analysis tools (finite element analysis, CFD) is preferred.
• Good technical writing and documentation skills.
• Ability to work on-site at the Kulim, Malaysia location and to follow manufacturing safety and quality procedures.
• Effective teamwork and communication skills within multidisciplinary engineering teams.

Education Requirements

This internship is intended for undergraduate students who have completed the EBB302 Advanced Packaging Flagship Curriculum at Universiti Sains Malaysia (USM) and who are required to undertake a compulsory industrial training/internship placement. (Undergraduate-level enrollment/completion and eligibility for industrial training are required.)

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.

Date Posted: 2026-04-28