Advanced Packaging Engineer

Job Title

Advanced Packaging Engineer

Role Summary

The Advanced Packaging Engineer will lead design, development and integration of co-packaged optics solutions that connect Silicon Photonics (SiPh) PICs and high-speed electrical ASICs. The role focuses on 2.5D/3D heterogeneous integration, fiber-to-chip coupling, and thermal/mechanical optimization to deliver production-ready optical engines.

Experience Level

Senior — requires extensive industry experience; posting specifies 10+ years in semiconductor packaging with a photonic/optoelectronic focus.

Responsibilities

Primary responsibilities include architecture, integration, simulation, and failure analysis to enable manufacturable, reliable co-packaged optical solutions.

• Define package architecture and 2.5D/3D integration strategies for co-packaging (TSV, RDL, hybrid bonding for SiPh chiplet integration).
• Design and develop low-loss fiber-to-chip optical coupling solutions in collaboration with cross-functional teams.
• Develop and optimize packaging assembly flows (die-to-wafer and wafer-to-wafer) for manufacturability (DfM) and reliability (DfR).
• Perform multiphysics simulations (thermal, mechanical/warpage, opto-electronic) to validate designs.
• Lead root cause and failure analysis on high-speed electro-optical packages and implement corrective actions.
• Collaborate with test, reliability, and manufacturing teams to transfer designs into production and support yield ramp.

Requirements

Must-have technical skills and experience; listing preferred items separately.

• 10+ years of experience in semiconductor packaging (2.5D/3D) with emphasis on photonic or optoelectronic packaging.
• Hands-on experience with heterogeneous integration techniques (TSV, RDL, hybrid bonding) and fiber-to-chip coupling methods.
• Experience developing and optimizing die-to-wafer and wafer-to-wafer assembly flows for manufacturability and reliability.
• Proficiency with multiphysics simulation tools for thermal and mechanical analysis (e.g., Ansys) and familiarity with EDA tools (e.g., Cadence).
• Scripting or automation experience (Python) for test automation and data analysis.
• Experience with yield and reliability methodologies: DOE, SPC, FMEA.
• Strong troubleshooting and failure-analysis skills for high-speed electro-optical packages.

Education Requirements

Master's or PhD in Electrical Engineering, Materials Science, Applied Physics, or a related technical field (as stated in the posting).

About the Company

Company: GlobalFoundries

Headquarters: Saratoga Springs, New York, USA

GlobalFoundries is a leading contract manufacturer for the global semiconductor industry, with facilities in multiple countries, including the USA. The company develops a broad portfolio of semiconductor technologies and employs around 13,000 people worldwide. GlobalFoundries focuses on enhancing competitiveness in specialized application solutions and fostering innovation in mobile communications, consumer electronics, and automotive applications.