Advanced Packaging Development Engineer
BroadcomJob Title
Advanced Packaging Development Engineer
Role Summary
Develop and enable advanced semiconductor packaging technologies to integrate memory dies and SoC dies for AI accelerator and networking products. The role focuses on technology roadmap, component development, reliability qualification, and yield ramp support.
Experience Level
Senior-level. Position expects a senior engineer with significant industry experience; see Education Requirements for degree and years guidance.
Responsibilities
Core responsibilities include technical leadership, development, qualification, and ramp support for advanced packaging technologies.
- Define packaging technology roadmap aligned to product needs (3–5 year horizon).
- Develop and enable key components for advanced packages, including HBM, iVR, and silicon capacitors.
- Design and manage reliability test plans to qualify new technology.
- Lead yield-improvement activities during new-technology ramp-up.
- Collaborate across engineering, manufacturing, and supply chain teams to enable product integration.
- Drive technology innovation and provide project-level technical leadership.
Requirements
Must-have technical skills and behaviors for successful performance in this role.
- Hands-on experience with 2.5D/3D integration and HBM technologies, including reliability and yield improvement work.
- Experience in developing or qualifying packaging components such as iVR and silicon capacitors.
- Proven ability to plan and execute reliability qualification test campaigns.
- Track record of driving yield improvements during new-technology ramp-up.
- Strong project management and cross-functional collaboration skills.
- Ability to lead technical teams and communicate with stakeholders at multiple levels.
- Nice-to-have: prior work on AI accelerator or networking chip packaging and supply-chain qualification experience.
Education Requirements
Required: M.S. in a related engineering field plus at least 10 years of direct post-degree experience, or a Ph.D. in a related engineering field plus at least 7 years of direct post-degree experience. (The posting specifies these degree-and-experience combinations as required.)
Compensation and Benefits
Annual base salary range: $127,100 - $203,400 (USD, yearly). Role is eligible for discretionary annual bonus and equity awards. Broad benefits include medical, dental, vision, 401(k) with company match, Employee Stock Purchase Program, paid holidays, sick leave, and vacation in accordance with company policies and applicable laws.
About the Company
Company: Broadcom
Headquarters: Irvine, California, United States
Broadcom is a global technology leader that designs, develops, and supplies a wide range of semiconductor and infrastructure software solutions. The company is known for its innovations in wireless and broadband communications, enabling a connected world.
