Advanced Packaging Cryogenic Modeling Engineer

Job Title

Advanced Packaging Cryogenic Modeling Engineer

Role Summary

Develop and apply cryogenic thermal, mechanical, and electrical models to support cryogenic packaging and 3D heterogeneous integration R&D. Use commercial multi-physics simulation tools to capture low-temperature material behavior and thermo-mechanical effects to guide device, integration, and advanced packaging decisions.

The role interacts extensively with integration, device, and design engineering teams to correlate models with measurements and drive technology choices.

Experience Level

Senior — requires advanced degree with substantial experience. Typical guidance: M.S. plus a minimum of 10 years relevant experience; PhD with 8+ years preferred.

Responsibilities

The engineer will build, validate, and apply cryogenic models and communicate results to engineering teams.

• Develop and correlate cryogenic thermal, mechanical, and/or electrical models using commercial simulation software for temperatures ~77 K and below, including temperature-dependent material properties and appropriate boundary conditions.
• Perform stress simulations for continuous and discontinuous active areas and evaluate stress impact on device performance.
• Simulate cryogenic semiconductor process flows to identify potential integration or process concerns.
• Anticipate integration/process issues from modeling results and provided integration/process/design information.
• Facilitate discussions with originating teams to identify critical simulations and drive optimal 3DHI technology decisions.
• Work closely with integration, device, and design engineers to ensure development of manufacturable technology.
• Follow Environmental, Health, Safety & Security requirements and perform other duties as assigned.

Requirements

Must-have technical qualifications and skills; preferred items listed where applicable.

• Demonstrated cryogenic modeling experience for semiconductor devices and advanced packages using commercial tools (e.g., Ansys Mechanical Workbench or equivalent) for mechanical, thermal, and/or electrical simulations.
• Strong problem-solving and technical troubleshooting skills, including experience designing experiments and correlating models to data.
• Solid understanding of semiconductor processes and integration techniques.
• Proficiency with engineering software and good general computer skills.
• Ability to clearly present technical results to small and large groups; English fluency (written and verbal).
• Willingness to travel up to 10%.
• Nice-to-have: thermal and electrical simulation experience for IC circuit designs (RF/analog preferred), familiarity with LVS/DRC and Cadence/Mentor/Keysight toolsets, prior leadership or project management experience, and strong planning and organizational skills.

Education Requirements

Required: M.S. degree plus a minimum of 10 years of relevant experience. Minimum overall GPA of 3.0 required. Preferred: Ph.D. with 8+ years of relevant experience. (No specific field of study was specified beyond semiconductor-related technical background.)

About the Company

Company: GlobalFoundries

Headquarters: Saratoga Springs, New York, USA

GlobalFoundries is a leading contract manufacturer for the global semiconductor industry, with facilities in multiple countries, including the USA. The company develops a broad portfolio of semiconductor technologies and employs around 13,000 people worldwide. GlobalFoundries focuses on enhancing competitiveness in specialized application solutions and fostering innovation in mobile communications, consumer electronics, and automotive applications.