Advanced Package Technology Engineer

Job Title

Advanced Package Technology Engineer

Role Summary

Develop and qualify high-performance custom semiconductor packaging solutions (2.5D/3D). Work with silicon and package design, suppliers, NPI, and customers to meet signal integrity, thermal, mechanical reliability, and schedule requirements.

Lead supplier engagement, qualification programs, and cross-functional activities to support new design wins and volume ramps.

Experience Level

Mid-level. Typical hands-on experience expected: approximately 4–6 years in 2.5D/3D package development; see Education Requirements for degree/alternate qualification guidance.

Responsibilities

Primary responsibilities include technical leadership, supplier engagement, program management, and cross-team coordination for advanced package solutions.

• Provide subject-matter expertise in 2.5D/3D packaging technologies and consolidate customer requirements toward unified solutions.
• Lead identification, development and qualification of advanced package and interposer solutions with external assembly partners.
• Drive memory supplier engagement to define technology and quality requirements.
• Manage programs with internal teams (design, test, NPI) and external suppliers through NPI and volume ramp phases.
• Develop alternate sourcing strategies and qualification plans.
• Support failure analysis, design rule definition, BOM decisions, and supplier selection.
• Communicate technical status and risks to stakeholders; may require periodic travel.

Requirements

Focused list of technical and interpersonal requirements. Education and degree-specific experience are summarized separately under Education Requirements.

• Must-have: 4–6 years hands-on experience in 2.5D/3D package development and qualification.
• Must-have: In-depth knowledge of silicon bumping, interposers, substrates, assembly processes, materials selection, and BOM definition.
• Must-have: Practical experience with thermal and mechanical interactions, reliability challenges, and failure analysis techniques.
• Must-have: Hands-on modeling and CAD tool experience for thermal/mechanical analysis and substrate/PCB design (examples: APD, AutoCAD, SolidWorks or equivalent).
• Must-have: Experience managing supplier qualification, NPI program activities, and cross-functional projects.
• Nice-to-have: Direct experience with memory supplier engagement, alternate sourcing strategies, or advanced multi-layer ceramic/organic substrates and thermally enhanced packages.
• Interpersonal: Strong project management, problem-solving, and communication skills; ability to work across global teams.

Education Requirements

Master's degree in Mechanical, Electrical, or Electronics Engineering with 6+ years of relevant packaging experience; OR PhD in a relevant engineering discipline with 3+ years of relevant experience. (Degree and specified years of experience provided in the source.)

About the Company

Company: Broadcom

Headquarters: Irvine, California, United States

Broadcom is a global technology leader that designs, develops, and supplies a wide range of semiconductor and infrastructure software solutions. The company is known for its innovations in wireless and broadband communications, enabling a connected world.