Advanced Package Technology Development PI Staff Engineer

Job Title

Advanced Package Technology Development PI Staff Engineer

Role Summary

Lead advanced packaging technology development for Micron's Advanced Package Technology Development (APTD) organization at Fab-16 in Taichung. Drive technology strategy, oversee process development and product transfer, and coordinate cross-functional stakeholders to deliver reliable, cost-effective packaging solutions.

Provide technical and organizational leadership, ensure compliance with company processes, and mentor functional leaders to implement sustainable solutions that meet schedule, cost, and reliability targets.

Experience Level

Senior-level. The role expects significant industry experience: typically 5+ years in the packaging industry, including at least 3 years in advanced packaging.

Responsibilities

Key responsibilities include strategy, technical leadership, cross-functional execution, and people development.

• Define and communicate long-term technology development strategy and objectives.
• Provide technical leadership and make technology decisions that align with department goals.
• Represent assembly/packaging in cross-functional initiatives and coordinate with peers across teams.
• Plan and manage deliverables, milestones, and resources to ensure timely product transfer and manufacturing readiness.
• Drive quality improvements, cost control, and production efficiency through process and data-driven actions.
• Ensure organizational compliance with company and departmental processes for technology development and transfers.
• Mentor and develop technical leaders; promote skill growth and cross-functional competency.

Requirements

Must-have technical skills, experience, and behaviors for success in this role.

• Minimum 5 years in the packaging industry, including at least 3 years in advanced packaging process development.
• Proven track record of leading technology development to industrial scale and successful product transfer.
• Deep knowledge of advanced package process development and architectures (e.g., 2.5D, 3DIC, fan-out, hybrid bond).
• Strong skills in data extraction, analysis, and reporting (system data mining, JMP, statistical analysis).
• Understanding of probe, parametric, backend and reliability testing and how process changes affect yield, performance, and reliability.
• In-depth knowledge of electronic materials, processing, physical/chemical/electrical properties, failure analysis, and characterization techniques.
• Proven troubleshooting and root-cause analysis ability; effective prioritization of complex tasks under tight timelines.
• Strong communication skills for alignment across cross-functional teams; able to self-direct with minimal supervision.
• Fluent English communication skills.

Nice-to-have:

• Experience leveraging AI tools (large language models, code assistants) to improve development workflows and productivity.

Education Requirements

MS or Ph.D. in Electrical Engineering, Computer Engineering, Chemistry, Physics, Materials Science, or a related technical field.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.