Advanced Package Design Senior Staff Engineer

Job Title

Advanced Package Design Senior Staff Engineer

Role Summary

Lead development of advanced high-speed IC packaging solutions to support next-generation semiconductor products. Work within Marvell s central advanced packaging organization to define package requirements, drive electrical design and floorplanning, and ensure manufacturability, reliability, and performance for products supporting very high data rates.

Experience Level

Senior. Typical background: Bachelor s degree plus 7+ years of relevant experience, or a Master s or PhD with 5+ years of experience.

Responsibilities

Design and deliver production-ready IC packages and related electrical solutions.

• Lead package development: floorplanning, netlist creation, and BGA map definition.
• Optimize signal integrity, power integrity, thermal and mechanical performance, manufacturability, reliability, and cost.
• Drive layout implementation with package operations and layout teams to meet product and manufacturing requirements.
• Define package requirements and specifications in collaboration with system architects, IC design, and marketing stakeholders.
• Manage cross-functional interactions with IC layout, analog/digital designers, SI/PI, thermal-mechanical, and assembly teams.
• Use EM and SI tools to validate designs and guide manufacturing decisions.
• Contribute to new packaging technology evaluation and introduction from concept through production.

Requirements

Must-have skills and experience to perform this role successfully.

• Experience with high-speed electronic packaging for digital and analog ICs, including package floor planning, netlist and schematic development, and BGA mapping.
• Experience with 2.5D and 3D package development and knowledge of packaging technologies, materials, substrate design rules, and assembly rules.
• Practical experience with SI and PI analysis and relevant tools such as PowerSI, SIwave or similar.
• Familiarity with EM simulation tools such as Ansys HFSS, SI-Wave, Cadence Clarity or equivalent.
• Basic proficiency with package floor planning and layout tools such as integrated system planner and APD.
• Ability to automate SI, PI, and packaging tasks using scripting tools, e.g. Python.
• Proven ability to lead cross-functional design and manufacturing activities and drive new product introductions.
• Strong communication, presentation, and documentation skills; ability to work effectively in multidisciplinary teams.
• Eligibility to access export-controlled technology; candidates may be subject to export license review.

Nice to have:

• Experience with CPC or CPO connectors.
• Track record of production releases and cost optimization in packaging.

Education Requirements

At least a Bachelor s degree in Computer Science, Electrical Engineering, or a related field plus 7+ years of relevant experience; or a Master s degree and/or PhD in Computer Science, Electrical Engineering, or a related field with 5+ years of experience.

About the Company

Company: Marvell Technology

Headquarters: Santa Clara, California, United States

Marvell’s semiconductor solutions serve as essential building blocks of the data infrastructure connecting our world, driving innovation across enterprise, cloud, AI, and carrier architectures. The company focuses on creating transformative technology that shapes the future.