Advance Packaging Process Development Engineer

Job Title

Advance Packaging Process Development Engineer

Role Summary

Individual contributor on the Assembly Package Process Development team responsible for developing, configuring and optimizing package assembly and wafer‑level processes to support product ramp. Work closely with manufacturing and global design teams to certify processes and enable production readiness.

Experience Level

Entry-level (0–2 years) in semiconductor manufacturing or a related field; hands-on experience in packaging or frontend processes is expected.

Responsibilities

Key day‑to‑day responsibilities include process development, data analysis, and cross‑functional coordination.

• Develop, configure and optimize front‑end, bonding and back‑end package assembly processes.
• Perform side‑by‑side process qualification and certification with manufacturing teams.
• Measure process performance, analyze data, and implement parameter optimizations.
• Author and maintain assembly process guidelines and interface with global design teams.
• Run, test and upgrade equipment and process flows; participate in change control (CCB) reviews and approvals.
• Identify and mitigate technical risks for bumping, TSV and other advanced package technologies.

Requirements

Solid practical skills and behavioral attributes required to perform the role.

• Must have: Hands‑on experience in semiconductor packaging or frontend manufacturing processes; strong analytical and problem‑solving skills.
• Must have: Effective verbal and written communication; ability to work with cross‑functional and global teams.
• Must have: Ability to work in a fast‑paced environment and adapt to shifting priorities and time zones.
• Nice to have: Experience with High Bandwidth Memory (HBM) integration and wafer‑level packaging integration.
• Nice to have: Practical exposure to Thermal Compression Bonding (TCB), Chemical Mechanical Planarization (CMP), ball mount, flip chip, underfill, hybrid bond, PVD/CVD, photo processes, wafer molding, or glass carrier bond/de‑bond.
• Behavioral: Collaborative team player with attention to detail and accountability.

Education Requirements

Bachelor's degree in Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, Physics or a related field. Master's or PhD preferred.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.