3D IC Solutions Engineer – Power, EMIR and Reliability

Job Title

3D IC Solutions Engineer – Power, EMIR and Reliability

Role Summary

Join the 3D IC Solutions Engineering team to define and deliver end-to-end workflows for power, EMIR (electromigration and IR-drop) and reliability analysis of 2.5D/3D System-in-Package designs. The role integrates Siemens EDA tools across architectural planning, physical design, and multi-die electrical and thermo-mechanical analysis.

The position acts as a technical product owner: translating customer requirements into software deliverables, building rapid proof-of-concept demonstrators (including use of generative AI), validating workflows with reference or customer designs, and supporting customer engagements and sales/marketing as needed.

Experience Level

Mid-level - typically requires 5+ years in EDA physical design / implementation or analysis; 3+ years in product or field application engineering.

Responsibilities

The role focuses on solution definition, workflow development, validation, and customer-facing technical leadership.

• Define and drive workflows for power, EMIR and reliability analysis across 2.5D/3D SiP design phases (architecture, in-design, signoff-to-manufacturing).
• Serve as technical product owner: translate roadmap priorities and customer needs into software requirements and deliverables.
• Develop rapid proof-of-concept demonstrators (including leveraging generative AI) to clarify UX and requirements ahead of formal development.
• Use reference designs, test structures, and customer designs to develop, test, and validate workflows.
• Provide technical support to sales, marketing, and design services; create technical collateral (presentations, demos, videos, papers).
• Represent Siemens EDA in customer engagements and validate solutions on-site as required (periodic travel).

Requirements

Must-have technical skills and professional experience for successful performance in this role.

• Must-have: 5+ years experience in EDA physical design, implementation, or analysis with focus on power, EMIR and reliability for digital and analog/mixed-signal designs.
• Must-have: 3+ years product or field application engineering experience, including collaboration with software development teams to translate customer requirements into roadmap items.
• Must-have: Working knowledge of EDA tools, terminology, file formats, and design practices for advanced packaging and 2.5D/3D solutions.
• Must-have: Familiarity with vendor tools and categories such as physical design/implementation (e.g., Aprisa, 3DIC Compiler, Innovus), power and EMIR analysis (e.g., PowerPro, mPower, Redhawk, Voltus), and data formats (Verilog, LEF/DEF, GDS, OASIS).
• Must-have: Experience producing high-quality technical collateral: demos, presentations, visuals, videos, or publications.
• Must-have: Practical understanding of generative and agentic AI technologies and how to apply them to proof-of-concept development.
• Must-have: Ability and willingness to travel periodically for customer work.
• Must-have: Ability to comply with U.S. export control requirements; employment contingent on U.S. Person status or obtaining required export licenses.
• Nice-to-have: Experience with specific EDA products named above and prior work on multi-die or SiP validation projects.

Education Requirements

BS in Electrical or Computer Engineering (required); MS preferred. Field: electrical engineering, computer engineering or related technical discipline.

About the Company

Company: Siemens

Headquarters: Munich, Germany

Siemens EDA is a leading global provider of Electronic Design Automation (EDA) products and systems. Their innovative solutions enable companies to enhance the development of electronic products efficiently and effectively, keeping pace with the complex demands of technology and physics. Siemens is committed to delivering advanced workflow solutions that integrate both EDA and MCAD tools for multi-domain design and manufacturing in the semiconductor industry.