3D IC Solutions Engineer – Package Design Engineer – EDA

Job Title

3D IC Solutions Engineer – Package Design Engineer – EDA

Role Summary

Siemens EDA is seeking a motivated and experienced individual to join their 3D IC Solutions Engineering team as a package design lead. The role focuses on advanced 2.5D and 3D System in Package (SIP) designs, driving innovative workflows for electronic product development.

Experience Level

Mid-level position requiring advanced experience in package physical design and verification.

Responsibilities

The responsibilities include:

• Drive the development of workflows for physical design planning, layout, and verification of advanced 3D IC designs.
• Manage package floor planning, functional/IO planning, interposer/substrate planning, and layout.
• Oversee package level connectivity, Logical Equivalence Checking (LEC), and physical DRC/DFM verification of package components.
• Collaborate with 3D IC Solutions teams to integrate workflows into the 3D IC Physical Design process.
• Utilize reference designs and customer designs for workflow development, testing, and validation.
• Provide technical support to sales and marketing design service organizations as needed.
• Travel periodically to work with customers on workflow solutions.

Requirements

The following qualifications are required:

• BS or MS in Electrical/Computer Engineering or equivalent.
• Advanced experience in package physical design and verification.
• Experience with Advanced Packaging IC EDA tools and design methods, including 2.5D and 3D solutions.
• Proficiency in package design tools such as Cadence and Siemens.
• Knowledge of signal/power integrity analysis tools.
• Familiarity with EDA data formats (Verilog, LEF/DEF, GDS, OASIS).
• Proficient in Windows and Linux operating systems.
• Scripting/programming skills in Python, Tcl, Perl, or similar languages.
• Understanding of ASIC design methodology from RTL synthesis to physical implementation phases.
• Experience with physical verification (DRC, LVS, IR/EM analysis) and DFT integration.
• Knowledge of thermal/stress analysis and optical design tools is a plus.
• Competency in Microsoft Word, Excel, and PowerPoint.

Education Requirements

BS or MS in Electrical/Computer Engineering or equivalent is expected.

About the Company

Company: Siemens

Headquarters: Wilsonville, OR, USA

Siemens EDA is a global leader in Electronic Design Automation (EDA), providing innovative solutions for electronic product development. The company specializes in advanced packaging solutions and is committed to driving the development of workflows for physical design planning, layout, and verification of advanced 3D IC designs.