3D IC Solutions Engineer — Package Design (EDA)

Job Title

3D IC Solutions Engineer — Package Design (EDA)

Role Summary

Lead the package design effort within the 3D IC Solutions Engineering team to develop end-to-end workflows for advanced 2.5D and 3D System-in-Package (SiP) designs. Work across EDA and MCAD toolchains to enable physical planning, layout, verification, electrical/thermal/mechanical analysis, and manufacturing test of multi-die packages.

This role involves workflow development, validation with reference or customer designs, and providing technical guidance to sales, marketing, and design services. Periodic customer travel may be required.

Experience Level

Senior-level. The posting indicates a senior position; explicit years of experience are not specified.

Responsibilities

Primary responsibilities focus on developing and validating package-level physical design and verification workflows and integrating those workflows across the 3D IC toolchain.

• Drive development of workflows for package floor planning, chiplet/IO planning, interposer/substrate planning, and package layout.
• Develop package-level connectivity, logical equivalence checking (LEC), and 3D stack verification (DRC/LVS) for package components (excluding chiplet internals).
• Implement physical DRC/DFM verification for package components and integrate other 3D IC workflows into the physical design flow.
• Use reference designs, test structures, and customer designs for workflow testing, validation, and performance assessment.
• Provide technical support and guidance to sales, marketing, and design services teams.
• Collaborate with customers and internal teams; occasional travel for customer engagements.

Requirements

Key technical requirements and practical skills for successful performance in the role.

• Advanced package physical design and verification experience (must-have).
• Familiarity with advanced packaging methods: 2.5D/3D solutions such as silicon interposers, FOWLP, and organic packages.
• Experience with EDA packaging tools and flows (examples: APD/SiP, Siemens XSI/XPD) and detailed knowledge of EDA data formats (Verilog, LEF/DEF, GDS, OASIS).
• Signal and power integrity analysis experience or working knowledge (tools like HyperLynx, Ansys RedHawk, Cadence Sigrity/Clearity) (must-have).
• Proficient in scripting/programming (Python, Tcl, Perl or similar); GUI/Tk development is a plus.
• Working knowledge of Windows and Linux environments.
• Experience with ASIC design methodology from RTL synthesis through physical implementation, including RTL verification, LEC, and STA.
• Familiarity with place-and-route and physical verification tools and flows (examples: Aprisa, Nitro, Tanner, Synopsys, Cadence toolchains) and IR/EM analysis.
• DFT integration and ATE test support experience.
• Nice-to-have: competency with thermal/mechanical stress analysis and optical design tools (e.g., Siemens NX, Flowtherm, SimCenter 3D, Ansys Icepak/Lumerical) and experience with Microsoft Office for documentation/presentations.

Education Requirements

Bachelor's or Master’s degree in Electrical Engineering or Computer Engineering (BS/MS) is specified, or equivalent practical experience.

About the Company

Company: Siemens

Headquarters: Munich, Germany

Siemens EDA is a leading global provider of Electronic Design Automation (EDA) products and systems. Their innovative solutions enable companies to enhance the development of electronic products efficiently and effectively, keeping pace with the complex demands of technology and physics. Siemens is committed to delivering advanced workflow solutions that integrate both EDA and MCAD tools for multi-domain design and manufacturing in the semiconductor industry.