3D-IC Methodology Architect

Job Title

3D-IC Methodology Architect

Role Summary

Design and lead development of 3D-IC design and verification methodology for multi-die systems, with technical focus on EMAG, thermal and packaging flows. Lead a technical team, coordinate with EDA vendors and product teams, and mentor junior engineers to deliver heterogeneous-integration flows and training.

Experience Level

Senior — requires 15+ years of relevant industry experience and over 10 years in design or design enablement of IPs.

Responsibilities

Primary responsibilities include methodology development, technical leadership, and cross-functional coordination.

• Develop design and verification methodology for 3D-IC, including EMAG, thermal and package flows for multi-die systems.
• Lead technical team and drive standards across the organization and with vendors.
• Lead methodology development and training for heterogeneous integration flows for internal teams and customers.
• Partner with EDA vendors and internal PDK and design teams to develop and validate EDA flows.
• Work with product management and marketing to define customer requirements and support flow adoption.
• Coordinate with cross-geo, cross-functional teams to collect requirements and deliver timely resolutions.
• Mentor and train junior engineers; guide software and automation feature development.
• Perform work in compliance with Environmental, Health, Safety & Security requirements.

Requirements

Must-have technical skills, experience, and behaviors.

• Expertise in methodology design and model verification for RF, AMS, silicon photonics and packaging for wafer-to-wafer and die-to-wafer applications.
• Expert knowledge of industry-standard EDA tools and flows; strong understanding of analog, RF, AMS and digital design EDA flows.
• Minimum 15+ years of relevant industry experience; >10 years in relevant design or design enablement of IPs.
• Proficient with Unix environments.
• Strong technical written and verbal communication skills and ability to collaborate across cross-functional teams.
• Familiarity with version control, configuration management and regression processes.
• Excellent problem-solving, teaming and interpersonal skills.

Nice-to-have:

• Experience with Java coding and/or coursework or interest in generative AI.
• Project management, planning and organizational skills.

Education Requirements

Required: Bachelor of Engineering (B.E.) / B.Tech or equivalent degree in Engineering or a related technical field. Preferred: Master's or PhD, preferably in Electrical Engineering or related discipline. Equivalent practical industry experience is acceptable.

About the Company

Company: GlobalFoundries

Headquarters: Saratoga Springs, New York, USA

GlobalFoundries is a leading contract manufacturer for the global semiconductor industry, with facilities in multiple countries, including the USA. The company develops a broad portfolio of semiconductor technologies and employs around 13,000 people worldwide. GlobalFoundries focuses on enhancing competitiveness in specialized application solutions and fostering innovation in mobile communications, consumer electronics, and automotive applications.