3D-IC Application Engineer

Job Title

3D-IC Application Engineer

Role Summary

Join Siemens EDA Technology Solutions Sales as an Applications Engineer supporting consultative sales to semiconductor and electronic equipment manufacturers. The role focuses on securing technical design wins for Siemens EDA products and developing prototype 3DIC flows and integration scripts.

Work with account teams across the US and collaborate with global peers to deliver demos, benchmarks, and technical strategies that drive market share for Siemens EDA solutions.

Experience Level

Mid-level - typically requires around 4+ years of design experience and prior hands-on package or interposer layout work.

Responsibilities

The core responsibilities include:

• Drive technical design wins for Siemens EDA product families (Innovator 3D IC, Xpedition, Calibre, HyperLynx, etc.).
• Deliver technical presentations, product demonstrations, and benchmarks to customers and stakeholders.
• Develop solutions, account strategies, and integration scripts to build 3DIC workflows and tool chains.
• Prototype and help architect emerging 3DIC solutions and flows.
• Support key accounts across the US and communicate status to internal and external stakeholders.
• Collaborate with global teams; travel domestically and internationally as required.

Requirements

Key qualifications and skills. Education-related degree requirements are summarized separately below.

• Must-have: Significant experience in advanced IC package layout or interposer layout and practical experience with package design tools covering setup to manufacturing document generation.
• Must-have: Knowledge of IC package design tools such as Cadence APD/SiP and Siemens Xpedition/i3DL.
• Must-have: Scripting/programming experience (examples: Python, Tcl, VBS, Perl) and working knowledge of Windows and Linux.
• Must-have: Proficiency with Microsoft Word, Excel, and PowerPoint.
• Nice-to-have: Familiarity with package/interposer planning tools (XSI/i3DI, OrbitIO/ISP, Synopsys 3DIC Compiler) and IC data formats (Verilog, LEF/DEF, GDS, OASIS).
• Nice-to-have: Experience with 2.5D/3D chiplet-based platforms (InFO, CoWoS, EMIB, Foveros, etc.) and signal/power integrity tools (HyperLynx, Sigrity, SIWave).
• Nice-to-have: Experience with Siemens Calibre DRC/LVS and/or 3DSTACK solutions; prior Applications Engineer experience is preferred.
• Other: Ability to work independently, influence across levels, build customer rapport, and travel as needed.

Education Requirements

Posting specifies MSEE or BSEE (Master's or Bachelor’s in Electrical Engineering) and references 4+ years of design experience. Equivalent practical experience is acceptable where appropriate.

About the Company

Company: Siemens

Headquarters: Munich, Germany

Siemens EDA is a leading global provider of Electronic Design Automation (EDA) products and systems. Their innovative solutions enable companies to enhance the development of electronic products efficiently and effectively, keeping pace with the complex demands of technology and physics. Siemens is committed to delivering advanced workflow solutions that integrate both EDA and MCAD tools for multi-domain design and manufacturing in the semiconductor industry.