3D Heterogeneous Integration Development Intern (Summer 2027)
GlobalFoundriesJob Title
3D Heterogeneous Integration Development Intern (Summer 2027)
Role Summary
The intern will support advanced packaging and process-integration development including wafer-to-wafer and die-to-wafer hybrid bonding, TSV/TOV, and interposer technologies. Work involves experiments, data analysis, process modeling, and close collaboration with engineering, materials, equipment, characterization, and external partner teams.
Experience Level
Entry-level internship for current undergraduate or graduate students (internship).
Responsibilities
Core responsibilities during the internship:
- Plan and execute design of experiments (DOEs) using internal tools and partner equipment.
- Collect, analyze, and interpret engineering and characterization data.
- Develop or support process models to improve integration performance.
- Support daily integration, process-development activities, documentation, and technical troubleshooting.
- Collaborate with cross-functional and external teams to meet project objectives.
- Summarize results and communicate technical findings and recommended next steps to stakeholders.
- Follow Environmental, Health, Safety & Security requirements in all work activities.
Requirements
Must-have qualifications and logistical requirements:
- English fluency (written and verbal).
- Ability to work at least 40 hours per week during the internship period.
- Willingness to travel up to 10%.
- Basic laboratory/engineering safety awareness and ability to follow EHS procedures.
Nice-to-have (preferred):
- Prior related internship or co-op experience.
- Leadership experience in projects, teams, or competitions.
- Interest in leveraging AI tools and emerging technologies to improve productivity.
- Project management, planning, and organizational skills.
- Strong written and verbal communication skills.
- Experience with advanced semiconductor packaging, hybrid bonding, TSV/TOV, interposers, DOE, or engineering data analysis.
- Availability for a six-month co-op assignment is preferred.
Education Requirements
Must be at least a sophomore and actively pursuing a Bachelor's or Master's degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, or a related technical field through an accredited program during the internship. Minimum overall GPA of 3.0 and in good academic standing. Currently pursuing a PhD in Engineering or related field is listed as a preferred qualification.
About the Company
Company: GlobalFoundries
Headquarters: Saratoga Springs, New York, USA
GlobalFoundries is a leading contract manufacturer for the global semiconductor industry, with facilities in multiple countries, including the USA. The company develops a broad portfolio of semiconductor technologies and employs around 13,000 people worldwide. GlobalFoundries focuses on enhancing competitiveness in specialized application solutions and fostering innovation in mobile communications, consumer electronics, and automotive applications.
